Flip-Flop Clock Path Layout for Lower Power Interference

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Flip-flop semiconductor devices face high power consumption due to interference between adjacent clock paths, which increases as manufacturing technology advances and semiconductor sizes decrease.

Innovation Solution

The semiconductor device layout is optimized by reducing the number of horizontal clock paths and increasing the feasible space between them, using gate conductors to transmit periodic signals and thereby reducing Miller capacitances and interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If semiconductor sizes are reduced to advance manufacturing technology, then device integration and functionality are improved, but interference between adjacent clock paths increases and power consumption rises

Engineering Contradiction:
Improvedevice integrationVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent segments the clock path routing by directing different clock signals through different orientations (horizontal vs. vertical). First clock signals are routed through first clock paths, while second clock signals are routed through second clock paths that are substantially perpendicular to the first. This segmentation spatially separates interfering clock signals, reducing capacitive coupling and power consumption while maintaining high device integration.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If the number of clock paths is increased to support more functionality, then device capability is improved, but interference between adjacent clock paths increases and power consumption rises

Engineering Contradiction:
Improvedevice capabilityVSAvoidpower consumption
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent resolves clock path interference by transitioning from two-dimensional parallel routing to three-dimensional orthogonal routing. Clock paths are arranged in substantially perpendicular orientations, utilizing the vertical dimension to separate clock signals that would otherwise be adjacent in a planar layout. This dimensional change reduces capacitive coupling between clock paths while supporting increased device capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If distance between adjacent clock paths is decreased to reduce device area, then area efficiency is improved, but interference between clock paths increases and power consumption rises

Engineering Contradiction:
Improvedevice areaVSAvoidpower consumption
Core Design Contradiction:
Area of stationary objectVSLoss of energy

Solution Approach 1:

The patent introduces asymmetry in clock path routing by using different orientations (horizontal vs. vertical) for different clock signals. Instead of symmetric parallel routing where all clock paths run in the same direction, the design employs orthogonal routing patterns that reduce capacitive coupling. This asymmetric arrangement allows closer spacing while minimizing interference and power consumption.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a significant power reduction of 7% to 11% compared to existing layout techniques, achieved by minimizing interference and capacitance between clock paths.

Implementation Method 1

gate conductors to transmit periodic signals

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

reducing Miller capacitances and interference

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS12265775B2Semiconductor device with reduced power
Publication Date: 2025.04.01 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12265775B2 patent drawing
  • US12265775B2 patent drawing
  • US12265775B2 patent drawing

AI summary

A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a first conductive pattern disposed within a first region from a top view perspective and extending along a first direction, a first phase shift circuit disposed within the first region, a first transmission circuit disposed within a second region from the top view perspective, and a first gate conductor extending from the first region to the second region along a second direction perpendicular to the first direction. The first phase shift circuit and the first transmission circuit are electrically connected with the first conductive pattern through the first gate conductor.