Flip-Flop Circuit Layout for Fewer Sensitive Nodes
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Solution Overview
Problem
The miniaturization of integrated circuits has led to stricter design and manufacturing specifications, along with reliability challenges due to increased sensitivity, particularly in reducing the number of sensitive nodes within the circuits to enhance accuracy and reliability.
Innovation Solution
The integration of specific logic gates such as NOR and NAND circuits, along with reversed tri-state and stacked gate circuits, is employed to reduce the number of sensitive nodes, thereby improving the reliability and accuracy of the integrated circuits by optimizing the placement and configuration of these circuits within the IC design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of sensitive nodes is reduced through optimized logic gate integration, then reliability and accuracy are improved, but device complexity increases due to the need for reversed tri-state and stacked gate circuits
Solution Approach 1:
The patent merges multiple logic gate functions into integrated circuits with reversed tri-state and stacked gate configurations. By combining NOR and NAND circuits with specialized tri-state logic, the design reduces the total number of sensitive nodes while consolidating functionality into fewer, more complex circuit blocks, thereby improving reliability without proportionally increasing overall device complexity
Solution Approach 2:
The integrated circuit is segmented into distinct functional blocks including reversed tri-state logic gates and stacked gate circuits. This segmentation allows each module to be optimized independently for reliability, with the reversed tri-state gates specifically designed to minimize sensitive node exposure while maintaining overall system functionality
2Volume of moving object
If miniaturization is pursued to reduce device size, then power consumption decreases and functionality increases, but manufacturing precision requirements become stricter
Solution Approach 1:
The patent employs parameter changes in the logic gate design, specifically using reversed tri-state configurations and stacked gate arrangements that alter the electrical characteristics and sensitivity parameters. These parameter changes enable the circuit to maintain reliability at smaller scales by modifying how signals are processed and how sensitive nodes are protected, thereby accommodating miniaturization while managing manufacturing precision requirements
3Reliability
If the number of sensitive nodes is reduced, then soft error rate decreases and mean time between failures increases, but critical charge collection efficiency requirements become more stringent
Solution Approach 1:
The patent converts the potential harm of reduced critical charge collection efficiency into a benefit by using reversed tri-state logic gates. These gates are specifically designed to minimize the impact of charge collection variations by reducing the number of sensitive nodes that are exposed to charge leakage and noise, thereby transforming a manufacturing challenge into a reliability advantage
Data Source
AI summary
A flip-flop includes a first input circuit, a first NOR logic gate, a stacked gate circuit, a first NAND logic gate and an output circuit. The first input circuit generates a first signal responsive to at least a first data signal, a first or a second clock signal. The first NOR logic gate is coupled between a first and a second node, and generates a second signal responsive to the first signal and a first reset signal. The stacked gate circuit is coupled between the first and a third node, and generates a third signal responsive to the first signal. The first NAND logic gate is coupled between the third and a fourth node, and generates a fourth signal responsive to the third signal and a second reset signal. The output circuit is coupled to the fourth node, and generates a first output signal responsive to the fourth signal.