Flip-Flop Gate Topology for Soft Error Resilience

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Solution Overview

Problem

The miniaturization of integrated circuits poses challenges in design and manufacturing, leading to reliability and accuracy issues due to increased sensitivity and complexity, particularly in reducing the number of sensitive nodes within the circuits.

Innovation Solution

The integration of specific logic gates such as NOR and NAND circuits, along with stacked gate and reversed tri-state gate circuits, is used to reduce the number of sensitive nodes, enhancing the critical charge collection and thereby improving the reliability and accuracy of the integrated circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the integrated circuit is miniaturized to reduce device size and power consumption, then productivity and functionality are improved, but reliability deteriorates due to increased sensitivity and complexity

Engineering Contradiction:
ImprovefunctionalityVSAvoidreliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The circuit is divided into multiple independent logic blocks (first logic block, second logic block, third logic block) with distinct functions. Each block processes signals independently, reducing the impact of errors in one block on the overall circuit reliability while maintaining high functionality through parallel operation of multiple blocks.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Redundant logic paths and multiple logic blocks are designed in advance to compensate for potential failures. The circuit includes backup signal paths and multiple logic gates that can compensate for errors, providing a cushion against reliability issues before they manifest as circuit failures.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If the number of sensitive nodes is reduced to improve reliability, then device complexity increases due to additional logic gates and circuits

Engineering Contradiction:
ImprovereliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Multiple logic functions are merged into integrated logic blocks. The first, second, and third logic blocks each combine multiple logic gates (NAND, NOR, NOT gates) into unified functional units that reduce the number of discrete sensitive nodes while maintaining the necessary computational complexity through integrated design.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Each logic block is designed to perform multiple functions simultaneously. For example, the logic blocks process different signal paths (first signal path, second signal path, third signal path) with similar operational characteristics, allowing universal design patterns to be applied across multiple functions, thereby reducing overall circuit complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If additional logic gates are integrated to reduce sensitive nodes, then manufacturing precision requirements increase

Engineering Contradiction:
ImprovereliabilityVSAvoidmanufacturing precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

Different logic blocks are optimized for their specific local functions. Each logic block (first, second, third) is designed with tailored gate configurations suitable for its particular signal processing requirements, allowing manufacturing processes to be optimized locally for each block type rather than requiring uniform high precision across all circuit elements.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The circuit design utilizes different logic gate types (NAND, NOR, NOT gates) with varying electrical characteristics and sensitivity profiles. By changing the parameters of individual gates and blocks, the design accommodates manufacturing variations, as different gate types have different tolerances and can be manufactured with varying precision levels while maintaining overall circuit reliability.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20240396536A1Integrated circuit and method of forming the same
Publication Date: 2024.11.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240396536A1 patent drawing
  • US20240396536A1 patent drawing
  • US20240396536A1 patent drawing

AI summary

A flip-flop includes a first input circuit, a first NAND logic gate, a first stacked gate circuit, a first NOR logic gate, a first output circuit and a first set buffer circuit. The first input circuit is coupled to a first node. The first NAND logic gate is coupled between the first and second node. The first stacked gate circuit is coupled between the first and third node, and configured to generate a third signal responsive to the first signal. The first NOR logic gate is coupled between the third node and a fourth node. The first output circuit is coupled to the fourth node. The first set buffer circuit is coupled to the first NOR logic gate.