Floating Metal Structure in Semiconductor Packages for BEOL Integration
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Solution Overview
Problem
Existing semiconductor package technologies are not suitable for back-end of line (BEOL) processing, particularly in creating a metallic structure that can be floating and mechanically movable, as they do not effectively address the need for precise fabrication of semiconductor packages with suspended portions.
Innovation Solution
A semiconductor package is designed with a semiconductor chip partially embedded in an encapsulation, featuring a metal structure with a floating portion formed by creating a recess in the encapsulation, which can be achieved through methods like laser processing or etching, and is electrically coupled to the chip, using metals such as copper, aluminum, or tungsten.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional semiconductor packaging techniques are used, then manufacturing processes are established, but floating metal portions suitable for BEOL processing cannot be created
Solution Approach 1:
The metal structure is divided into a fixed portion (attached to the substrate) and a floating portion (suspended above the substrate). This segmentation allows the floating portion to be created through selective removal of encapsulation material, enabling BEOL processing compatibility while maintaining manufacturing feasibility through standard lithography and etching techniques.
Solution Approach 2:
The encapsulation material is removed in advance to create a recess before the metal structure is fully formed. This preliminary action allows the metal to be deposited into the recess, creating the floating portion configuration that is compatible with BEOL processing requirements.
2Adaptability or versatility
If a metal structure with floating portion is created, then mechanical flexibility and application versatility are enabled, but manufacturing precision requirements increase
Solution Approach 1:
The encapsulation material serves as an intermediary that is selectively removed to create the floating structure. By using the encapsulation as a temporary support that is then removed, the process achieves high precision floating portion formation without requiring direct manipulation of the metal structure during fabrication, thus managing precision requirements through a mediating material.
3Adaptability or versatility
If floating metal portions are implemented, then applications like antennas and sensors are enabled, but device complexity increases
Solution Approach 1:
The floating metal portion structure serves multiple functions: it can act as an antenna, a sensor element, or a mechanical component. By creating a universal floating structure that can be configured for different applications through standard fabrication processes, the patent enables multi-functionality without proportionally increasing device complexity, as the same basic structure serves various purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of semiconductor packages with floating metal portions suitable for BEOL processing, allowing for integration with other components and enabling applications like antennas, speakers, and sensors, while providing electrical connectivity and mechanical flexibility.
Implementation Method 1
forming a floating portion of the metal structure by forming a recess in the encapsulation, which can be achieved through methods like laser processing or etching
Data Source
AI summary
Examples disclose a semiconductor package including a semiconductor chip, an encapsulation, and a metal structure. The semiconductor chip is at least partially embedded in the encapsulation. The metal structure is formed on an outer surface of the encapsulation and includes a floating portion. The floating portion is floating on the encapsulation and the metal structure is electrically coupled with the semiconductor chip. Further examples disclose a method for manufacturing a semiconductor package, the method including providing a semiconductor chip at least partially embedded in an encapsulation; providing a metal structure on the encapsulation; forming a floating portion of the metal structure by forming a recess in the encapsulation.