Decorative Surface Effects TRIZ Cases

A protection-layer process enables precise decoration only inside laser-etched grooves on automobile exterior surfaces, supporting complex multi-color finishes.

A recessed encapsulation creates a suspended metal portion that stays chip-connected, enabling BEOL-compatible antennas, sensors, and speakers.

Angled laser entry from the substrate edge guides crack propagation for kerf-free wafer separation with low TTV and reduced material loss.

Directly bonded conductive interface features form a gas-sealed cavity around integrated devices, reducing contamination and adhesive-related reliability risks.

A segmented mineral and carbon sacrificial-layer process protects the getter during etching while preserving vacuum insulation and cavity strength.

Micromechanical structures in WLCSP redistribution layers shift solder bumps with PCB thermal expansion to cut shear stress and improve cycling reliability.

Ion beam deposition and etching tune thin-film crystal planes to cut oxidation risk and improve heat flow in near-field transducers.

A flat exposed membrane and FOWLP packaging improve MEMS transducer acoustic coupling while simplifying cavity-free integration with ASICs.

An adapter chip between stacked MEMS and ASIC dies blocks adhesive overflow, protects bond pads, and keeps the package footprint compact.

Getter material built into capacitive sensor electrodes traps cavity gases, preserving pressure measurement accuracy without enlarging the sensor.

Protruding lead portions prevent insulation-layer undercutting during slit etching, preserving bonding strength and electrical insulation.

Bosch-etched vertical trenches are filled with a high-Z nanoparticle paste, avoiding metal mask defects and costly cleanroom deposition.

Sub-bandgap laser etching forms internal vias, waveguides, and fluidic channels in semiconductors for compact 3D interconnect routing.

Ion beam deposition and milling tune thin-film crystal planes to cut near-field transducer oxidation and thermal degradation.

Positioning sheets and alignment portions improve lid placement and bonding accuracy despite wiring board dimensional variation.

Selective wet etching lifts embedded interconnects above dished substrate regions, creating flatter bonding surfaces and more reliable coupling.

A rigid support base with localized protrusions or recesses limits substrate deformation stress, preserving surface stress measurement precision.

A single SiC chip combines pressure and temperature sensing to correct thermal drift and survive combustion-chamber heat.

Insulating layers on adjacent MEMS combs prevent short circuits and adsorptive damage in micro-mirrors while preserving stable electrostatic actuation.

HF vapour etching removes SiO2 sacrificial layers, then oxygen, fluorine, hydrogen, or XeF2 clears silicon residue from Si3N4 microstructures.

An elevated ceramic plate inside a cavity decouples MEMS sensors from soldering and thermal-expansion stress while preserving ASIC connections.