Stacked MEMS Chip Package for Grounded Wire Interconnection

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Solution Overview

Problem

Existing chip packages face challenges in establishing reliable electrical connections between stacked micro-electromechanical systems (MEMS) and application specific integrated circuit (ASIC) chips, while also balancing miniaturization and structural strengthening.

Innovation Solution

A chip package design that includes a MEMS chip with a conductive element and bonding wire embedded in a molding compound, along with a redistribution layer and conductive structure, facilitates electrical connections and addresses grounding and shielding issues, achieving integration of chips with different functions and balancing miniaturization with structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple chips are stacked to achieve multiple functions, then the functionality and integration are improved, but the electrical connection between different chips becomes difficult to establish

Engineering Contradiction:

ImprovefunctionalityVSAvoidelectrical connection

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent introduces a molding compound as an intermediary medium that contains conductive elements and bonding wires. This mediator enables electrical connections between stacked chips by providing a controlled environment for signal transmission, grounding, and shielding without requiring direct chip-to-chip contact, thus resolving the electrical connection difficulty while maintaining multi-functionality

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The molding compound serves multiple functions simultaneously: it provides mechanical support, electrical insulation, signal transmission pathways through embedded conductive elements, grounding connections, and electromagnetic shielding. This multi-functional approach enables reliable electrical connections between stacked chips while maintaining the compact multi-chip structure

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Volume of moving object

If the chip package is miniaturized, then the size is reduced, but the structural strengthening becomes difficult to achieve

Engineering Contradiction:

Improvepackage sizeVSAvoidstructural integrity

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent merges the protective encapsulation function with structural support and electrical functionality into a single molding compound component. This consolidation provides comprehensive structural strengthening for the miniaturized package while maintaining compact dimensions, as the molding compound simultaneously protects chips, supports bonding wires, and provides mechanical rigidity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The molding compound acts as a composite material system that combines structural support, electrical insulation, and protective properties in one integrated medium. This composite approach enables the miniaturized package to achieve adequate structural strength without increasing size, as the molding compound provides multiple functions that would otherwise require separate components

Inventive Principle:

Principle #40Composite materials

3Strength

If the chip package structure is strengthened, then the structural integrity is improved, but the miniaturization design becomes difficult to achieve

Engineering Contradiction:

Improvestructural integrityVSAvoidpackage size

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The molding compound merges multiple structural and protective functions into a single integrated component that provides comprehensive support without requiring additional strengthening elements. This consolidation achieves structural integrity through the molding compound's inherent properties rather than adding separate reinforcement structures, thereby avoiding size increase

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If conductive elements and bonding wires are exposed, then the electrical connection is accessible, but the grounding and shielding of MEMS becomes difficult

Engineering Contradiction:

Improveelectrical connectionVSAvoidgrounding and shielding

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The molding compound serves as an intermediary that embeds conductive elements and bonding wires within its matrix, providing both electrical connection pathways and simultaneous grounding/shielding capabilities. This mediator approach allows MEMS structures to be properly grounded and shielded against electromagnetic interference while maintaining accessible electrical connections through the molded-in conductors

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20240116751A1Chip package and manufacturing method thereof

Publication Date: 2024.04.11 XINTEC INC

AI summary

A chip package includes an application chip, a micro-electromechanical systems (MEMS) chip, a conductive element, a bonding wire, and a molding compound. The application chip has a conductive pad. The MEMS chip is located on the application chip, and includes a main body and a cap. The main body is located between the cap and the application chip. The main body has a conductive pad. The conductive element is located on the conductive pad of the main body of the MEMS chip. The bonding wire extends from the conductive element to the conductive pad of the application chip. The molding compound is located on the application chip and surrounds the MEMS chip. The conductive element and the bonding wire are located in the molding compound.