Imprint Mold Temperature Control for Nanometer Flattening Accuracy
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Solution Overview
Problem
Conventional flattening techniques using molds in semiconductor manufacturing face challenges in controlling level differences on substrates at the nanometer scale due to temperature changes in the mold during the light curing process, affecting the accuracy of the flattening process.
Innovation Solution
A flattening apparatus that includes a mold holding unit, a substrate holding unit, an exposure unit, a gas suction unit, a gas supply unit, and a control unit to adjust the mold temperature by supplying gas during the flattening process, reducing temperature changes and improving accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the mold is irradiated with light to cure the composition, then the flattening process can be completed, but the mold temperature increases due to light absorption
Solution Approach 1:
The gas supply unit cools the mold before light irradiation to pre-establish the optimal temperature condition. This preliminary cooling action ensures that when irradiation begins, the mold is already at the correct temperature to minimize heat accumulation and maintain composition viscosity stability throughout the curing process.
Solution Approach 2:
Gas is introduced as an intermediary cooling medium between the mold and the heat source (light). The gas flows through the space between the mold and mold holding unit, acting as a thermal buffer that absorbs excess heat from the mold during irradiation, thereby maintaining stable mold temperature and preventing composition viscosity changes.
2Productivity
If the mold temperature changes during irradiation, then the light curing process can proceed, but the composition viscosity changes affecting flattening accuracy
Solution Approach 1:
Gas serves as an intermediary thermal control medium that mediates between the heat generated during light curing and the mold temperature. By controlling gas flow rate and temperature, the system maintains optimal mold temperature conditions throughout the curing process, ensuring composition viscosity remains stable while allowing rapid curing to proceed.
Solution Approach 2:
The system dynamically adjusts gas flow parameters (flow rate, temperature, pressure) in response to mold temperature measurements during irradiation. This real-time parameter adjustment ensures the mold temperature remains within the optimal range for maintaining composition viscosity stability, thereby preserving flattening accuracy throughout the curing process.
3Manufacturing precision
If gas is supplied to cool the mold, then the temperature change is reduced, but the device complexity increases
Solution Approach 1:
The gas supply unit serves multiple functions: it cools the mold during irradiation, removes volatile byproducts from the curing process, and creates a controlled atmosphere between the mold and mold holding unit. This multi-functionality justifies the added device complexity by providing several benefits from a single integrated system.
Solution Approach 2:
The invention uses pneumatic principles to deliver cooling gas through the mold holding unit structure. By utilizing gas flow dynamics and pressure control, the system achieves efficient thermal management without requiring complex mechanical cooling systems, thereby minimizing the increase in device complexity while maintaining high flattening accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively maintains the viscosity of the light curing composition, ensuring high accuracy and reliability in forming uniform patterns on substrates by controlling the mold temperature, thereby enhancing the flattening process.
Implementation Method 1
a gas suction unit configured to suck gas from a spatial region between the mold and the mold holding unit, a gas supply unit configured to supply the gas to the spatial region
Implementation Method 2
an exposure unit configured to irradiate a light curing composition supplied onto the substrate with light at least via the mold to cure the composition
Implementation Method 3
a mold holding unit configured to suck and hold a mold including a flat portion
Data Source
AI summary
A flattening apparatus includes a mold holding unit configured to suck and hold a mold including a flat portion, a substrate holding unit holding a substrate, an exposure unit irradiating a light curing composition supplied onto the substrate with light at least via the mold to cure the composition, the composition being irradiated with the light and cured in a state where the flat portion of the mold is in contact with the composition on the substrate, a gas suction unit sucking gas from a spatial region between the mold and the mold holding unit, a gas supply unit supplying the gas to the spatial region, and a control unit controlling the gas suction unit and the gas supply unit to perform temperature adjustment processing for supplying the gas to the spatial region in a state where the mold is sucked and held onto the mold holding unit.