Hermetic Sensing Module Assembly for Moisture-Sensitive Detection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional sensing modules and manufacturing methods are susceptible to external impurities and ambient water and oxygen, leading to poor signal-to-noise ratio and limited sensitivity, particularly in light sensors made of organic polymer materials.
Innovation Solution
A sensing module and manufacturing method that forms a hermetic chamber by using a substrate with a sensor on one surface and an optical conversion element on the other, where a light source irradiates a colloid to solidify and isolate the environment, reducing the influence of foreign impurities and ambient water and oxygen.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensors are made using semiconductor materials, then the sensors can detect external information, but they are susceptible to foreign impurities and ambient water and oxygen which reduces detecting sensitivity
Solution Approach 1:
The patent creates a hermetic chamber that isolates the sensing element from the external environment, effectively creating an inert atmosphere free from foreign impurities, water, and oxygen. This is achieved by sealing the sensing element within an enclosed structure that prevents contact with harmful environmental factors, thereby maintaining high detecting sensitivity without degradation from environmental exposure.
Solution Approach 2:
The patent employs a hermetic chamber structure with sealing elements that act as protective barriers. The chamber uses sealing films or shells to enclose the sensing element, creating a physical isolation that protects against environmental contaminants while allowing the sensor to function. This flexible sealing approach enables the sensor to maintain sensitivity in various operating conditions.
2Manufacturing precision
If conventional manufacturing methods are used for sensing modules, then the process is relatively simple, but the manufacturing precision and hermetic sealing are difficult to achieve
Solution Approach 1:
The patent integrates the hermetic sealing structure with the sensor assembly by combining the sensing element, sealing chamber, and protective elements into a unified structure. This merging approach allows the hermetic sealing to be achieved as an inherent part of the manufacturing process rather than as a separate complex operation, thereby improving sealing quality without proportionally increasing manufacturing complexity.
Solution Approach 2:
The patent incorporates hermetic sealing features into the initial sensor assembly process, performing sealing actions during the primary manufacturing stages rather than as a subsequent separate operation. By preliminary integrating the hermetic chamber and sealing elements during sensor fabrication, the process achieves high sealing precision without requiring additional complex post-processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and enhances the accuracy and sensitivity of sensors by creating a hermetic environment that protects the sensing elements from environmental contaminants, improving the signal-to-noise ratio and overall performance.
Implementation Method 1
a light source irradiates the colloid via a second surface of the substrate to solidify the colloid
Implementation Method 2
the light from the light source excites an optical conversion layer of the substrate and emits another light to irradiate the colloid
Data Source
AI summary
The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.