Semiconductor Sensor Barrier Membrane for Contamination Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
A semiconductor device structure featuring a barrier with a membrane and strands that define through-holes, which can include conformal membrane layers and protrusion patterns to reduce contamination and improve manufacturability, and a stiffener structure to enhance rigidity and ease of handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but reliability decreases and cost increases
Solution Approach 1:
The package structure is divided into multiple functional segments: a body portion containing the semiconductor die, a lid portion providing protection, and a substrate with conductive traces. This segmentation allows each component to be optimized independently for its specific function, improving overall reliability while maintaining manufacturability through modular assembly processes.
Solution Approach 2:
The semiconductor die is nested within the package body, which is in turn nested within the protective lid structure. This nested arrangement protects the fragile die while consolidating multiple functions into a compact hierarchy, reducing the need for additional external components and simplifying the overall system.
2Volume of moving object
If conventional semiconductor packages are used, then manufacturing processes are less complex, but package size becomes too large
Solution Approach 1:
Multiple functional elements are merged into integrated structures: conductive traces are formed directly on the substrate, the lid and body form a unified protective enclosure, and bonding wires connect all components in a compact arrangement. This merging eliminates the need for separate mounting brackets, external connectors, and intermediate structures, significantly reducing package volume while maintaining ease of manufacture through standardized fabrication processes.
3Productivity
If conventional semiconductor packages are used, then production is faster, but performance is relatively low
Solution Approach 1:
The package structure employs optimized geometric parameters including trace width, spacing, and bonding wire routing to minimize parasitic inductance and resistance. The lid and body are positioned at precise distances from the die to optimize signal integrity and thermal management, enabling high-performance operation while maintaining production speeds through standardized fabrication tolerances.
Data Source
AI summary
In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.