Electronic Assembly With Floating Modules for Compact Liquid Cooling
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Solution Overview
Problem
Existing liquid cooling heat dissipation systems for electronic devices face challenges with low integration due to the need for numerous connection pipes to maintain close contact between high and low-power consumption components, occupying large mounting space and reducing system integration.
Innovation Solution
An electronic assembly with a liquid cooling heat dissipation module and floating modules, where each module includes a circuit board connected via an elastic connecting member to ensure close contact with the module, allowing independent floating without interference, reducing the need for extensive connection pipes and enabling compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large quantity of connection pipes are laid to ensure floating function of cooling plate and heat dissipation performance of vapor chamber, then heat dissipation reliability is improved, but mounting space is occupied and integration is reduced
Solution Approach 1:
The circuit board is divided into multiple independent floating modules, each capable of independent floating and heat dissipation. This segmentation eliminates the need for extensive connection pipes between components, as each module independently contacts the liquid cooling heat dissipation module, thereby reducing structural complexity while maintaining heat dissipation reliability
Solution Approach 2:
Floating modules are arranged on both sides of the liquid cooling heat dissipation module, utilizing three-dimensional space more efficiently. This spatial arrangement reduces the need for connection pipes that would otherwise occupy mounting space, thereby improving integration while ensuring reliable heat dissipation through direct contact
2Manufacturing precision
If a large quantity of connection pipes are laid to ensure floating function of cooling plate, then close contact between chip and cooling plate is achieved, but mounting space is occupied
Solution Approach 1:
The system is segmented into multiple floating modules, each independently achieving close contact with the liquid cooling heat dissipation module. This eliminates the need for connection pipes that would consume mounting space, while the elastic connecting members ensure each module maintains precise contact through elastic force
Solution Approach 2:
The elastic connecting member changes its elastic force parameter based on the distance between the chip and the liquid cooling heat dissipation module, automatically adjusting to ensure close contact. This dynamic parameter adjustment achieves precise contact without requiring fixed connection pipes, freeing up mounting space
3Reliability
If cooling plate is made floating to ensure close contact with chip, then heat dissipation performance is improved, but elastic connecting member is needed increasing device complexity
Solution Approach 1:
The elastic connecting member serves multiple functions: it provides elastic force to push the floating module toward the liquid cooling heat dissipation module, acts as a connecting element, and compensates for dimensional variations. This multi-functionality reduces the need for additional components, thereby limiting the increase in device complexity while ensuring improved heat dissipation performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation reliability, improves system integration, and reduces structural complexity by allowing multiple floating modules to be mounted on both sides of the liquid cooling heat dissipation module, increasing the number of high-power consumption chips that can be accommodated while maintaining efficient heat dissipation.
Implementation Method 1
the elastic connecting member may apply elastic force based on a distance between the chip on the floating module to which the elastic connecting member belongs and the liquid cooling heat dissipation module
Implementation Method 2
the chip abuts against the liquid cooling heat dissipation module
Data Source
AI summary
An electronic assembly includes a liquid cooling heat dissipation module and a plurality of floating modules. The floating modules are spaced apart on the liquid cooling heat dissipation module. The floating module includes a circuit board, a chip, and an elastic connecting member. The chip is disposed on one side of the circuit board, and the circuit board is connected to the liquid cooling heat dissipation module through the elastic connecting member. The elastic connecting member is configured to tightly press the circuit board against the liquid cooling heat dissipation module, so that the chip abuts against the liquid cooling heat dissipation module. The floating modules are independent of each other and do not interfere with each other. The elastic connecting member is disposed to ensure heat dissipation reliability of each chip in the electronic assembly.