Floating Substrate Carrier for ESD Reduction
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Solution Overview
Problem
The challenge in flat panel display manufacturing is the occurrence of electrostatic discharge during handling of large area substrates, which can cause defects and reduce yield, especially when grounding the substrate after testing, leading to significant voltage imbalances and potential destruction of electronic elements.
Innovation Solution
A substrate support unit with a substrate carrier structure that is electrically floating with respect to ground, reducing capacitive coupling and voltage variations by decoupling the substrate support from ground during testing and processing, thereby minimizing electrostatic discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the substrate is grounded after testing, then electrostatic discharge is eliminated, but voltage imbalances occur and electronic elements may be damaged
Solution Approach 1:
The substrate carrier structure is pre-configured with electrical insulation from ground before the substrate is placed on it. This preliminary insulation prevents the formation of voltage imbalances and electrostatic discharge that would occur if the substrate were grounded after testing, thereby protecting electronic elements while maintaining manufacturing yield.
Solution Approach 2:
The electrically insulating substrate carrier structure acts as an intermediary between the substrate and ground. This mediator allows the substrate to be handled and tested without direct electrical connection to ground, preventing harmful electrostatic discharge while avoiding the voltage imbalance problems associated with direct grounding.
2Stability of the object's composition
If the substrate support is decoupled from ground, then voltage variations are reduced, but capacitive coupling effects occur
Solution Approach 1:
The substrate carrier structure changes the electrical parameter of capacitance by providing electrical insulation from ground. This parameter change creates a controlled capacitive coupling environment that stabilizes electrostatic conditions during substrate handling and testing, reducing voltage variations while managing capacitive effects through the insulating material properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces electrostatic discharge and voltage imbalances, enhancing the yield of substrates by maintaining stable electrostatic conditions during handling and processing, preventing damage to electronic elements.
Implementation Method 1
The substrate carrier structure is electrically insulated from ground by a capacitance having a capacity of less than about 100 nF
Implementation Method 2
reducing capacitive coupling and voltage variations by decoupling the substrate support from ground during testing and processing
Data Source
AI summary
A substrate support unit adapted for a system for testing or processing of a substrate is provided. The substrate support unit includes a support table having at least one substrate carrier structure adapted to support a substrate, wherein the substrate carrier structure is electrically floating with respect to ground.