Flow-Guided Test Chamber for Uniform Semiconductor Testing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing test chambers for semiconductor devices experience temperature differences and gas flow bypass issues due to uneven air distribution, leading to reduced inspection efficiency and reliability.

Innovation Solution

A test chamber design with a rack structure and flow guide unit that includes spaced inlet and outlet portions, and first and second flow guide members to uniformly distribute and collect gas flow, minimizing temperature differences and bypass.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If air is supplied through a supply duct to test boards in the test chamber, then thermal stress can be applied to semiconductor devices, but temperature differences occur between semiconductor devices due to uneven air distribution and flow rates

Engineering Contradiction:

Improvetemperature uniformityVSAvoidtemperature control precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The supply duct is divided into multiple branch ducts that extend in the flow direction, with each branch duct supplying air to different regions of the test chamber. This segmentation ensures more uniform air distribution across multiple test boards, reducing temperature differences between semiconductor devices.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each branch duct is equipped with independent flow control capabilities, allowing the air flow rate to be adjusted locally for each branch. This enables precise control of temperature and flow conditions for different regions of the test chamber, ensuring uniform thermal stress application.

Inventive Principle:

Principle #3Local quality

2Productivity

If air flows through the supply duct to reach test boards, then thermal testing can be performed, but a portion of air flows around the test chamber instead of through the test boards, reducing inspection efficiency

Engineering Contradiction:

Improveinspection efficiencyVSAvoidgas flow loss

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

Flow guide members are introduced as intermediary components between the branch ducts and the test chamber. These flow guide members actively direct the air flow into the test chamber through the test boards, preventing bypass flow and ensuring that air passes through all test boards efficiently.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The flow guide members are positioned upstream to preemptively guide air flow before it can bypass the test chamber. By establishing proper flow direction early in the process, the system ensures maximum air utilization for testing purposes.

Inventive Principle:

Principle #10Preliminary action

3Temperature

If air flow rate inside the test chamber is reduced due to bypass flow, then energy consumption decreases, but temperature difference between semiconductor devices increases

Engineering Contradiction:

Improvetemperature uniformityVSAvoidenergy consumption

Core Design Contradiction:

TemperatureVSUse of energy by stationary object

Solution Approach 1:

Flow sensors are installed in each branch duct to detect air flow rates, and this information is fed back to a control unit. The control unit adjusts the flow control valves based on detected flow rates to maintain uniform temperature distribution, optimizing the balance between temperature uniformity and energy consumption.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances test reliability by reducing temperature variations and gas flow around the rack, ensuring uniform gas distribution and improved inspection consistency.

Implementation Method 1

a flow guide unit including a first flow guide member disposed to be adjacent to the inlet portion, having a first opening opposing the inlet portion and guiding the gas to flow into the inlet portion

Methodology Applied

Scientific EffectGas flow guidance:

Implementation Method 2

a burn-in test may be performed to inspect the lifespan and malfunctioning of a semiconductor package in an extreme environment outside of normal operating conditions. Generally, in the burn-in test, thermal stress is applied to a semiconductor device by circulating high or low temperature air within a test chamber

Methodology Applied

Scientific EffectThermal stress: Thermal Shock

Implementation Method 3

thermal stress is applied to a semiconductor device by circulating high or low temperature air within a test chamber

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250306084A1Test chamber and test apparatus

Publication Date: 2025.10.02 SAMSUNG ELECTRONICS CO LTD

AI summary

Provided are a test chamber and a test apparatus. The test chamber includes a rack including a plurality of support portions, arranged to be spaced apart from each other in a first direction of the rack, supporting a plurality of test boards, respectively, to accommodate one of the test boards in a slot defined by adjacent ones of the support portions, an inlet portion disposed on one side of the rack and introducing gas to the test board, and an outlet portion disposed on the other side of the rack, opposite to the one side of the rack, and discharging the gas and a flow guide unit including a first flow guide member disposed to be adjacent to the inlet portion, having a first opening opposing the inlet portion and guiding the gas to flow into the inlet portion.