Fluid Cooled LED p-n Junction Temperature Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High lumen light emitting diodes (LEDs) face challenges in maintaining a p-n junction temperature below 60°C due to increased heat generation with higher current, limiting their efficiency and lifespan, and existing heat sinks are bulky and restrict orientation and density of LED placement.
Innovation Solution
A fluid cooling system that cools and stabilizes the p-n junction of LEDs by transferring heat away from the junction, allowing for efficient heat dissipation and potentially using the fluid to power the LEDs through a turbine, enabling more consistent light output and longer lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high current is used to increase light output, then lumen output increases, but heat generation increases causing p-n junction temperature to exceed 60°C
Solution Approach 1:
The patent extracts the heat dissipation function from the LED structure by introducing a separate fluid cooling system. The fluid flows through channels in the heat sink, carrying heat away from the p-n junction independently of the LED optical path, allowing high current operation without temperature penalty
Solution Approach 2:
The patent introduces fluid as an intermediary cooling medium between the heat source (p-n junction) and the environment. The fluid absorbs heat through conduction from the heat sink and dissipates it through convection, mediating the heat transfer process to maintain junction temperature below 60°C while allowing high lumen output
2Temperature
If traditional heat sinks are used to dissipate heat, then temperature control is achieved, but the heat sinks are large and bulky limiting orientation and placement flexibility
Solution Approach 1:
The patent replaces traditional solid heat sinks with a hydraulic cooling system where fluid flows through channels in a compact heat dissipation structure. This allows heat to be carried away by the moving fluid rather than requiring a large stationary heat sink, reducing overall system volume while maintaining effective temperature control
Solution Approach 2:
The patent transitions from passive radial heat dissipation in traditional heat sinks to active directional heat removal through fluid flow channels. The fluid flow dimension allows heat to be extracted along the length of the LED module rather than only from the end, enabling more compact and orientation-flexible designs
3Productivity
If multiple LEDs are placed in close proximity to increase density, then lighting efficiency improves, but heat builds up faster making temperature control difficult
Solution Approach 1:
The patent segments the cooling function by providing separate fluid flow channels for each LED module or group of LEDs. This allows independent temperature control of each segment, enabling high LED density while preventing heat accumulation through targeted cooling of individual modules rather than relying on a shared cooling system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluid cooling system reduces power consumption and maintains p-n junction temperatures, allowing for higher LED density and orientation flexibility, with potential energy savings of 28% or more compared to non-fluid cooled systems.
Implementation Method 1
A fluid, preferably a liquid, cools and stabilizes the p-n junction of the light emitting diode
Implementation Method 2
The fluid can cool a heat sink, printed circuit board, metal plates to which the light emitting diode is mounted
Implementation Method 3
potentially using the fluid to power the LEDs through a turbine
Data Source
AI summary
A fluid cooled lighting element is disclosed. A fluid, preferably a liquid, cools and stabilizes the p-n junction of a light emitting diode thereby reducing the energy required to power the light emitting diode, lengthening its usable lifetime, and outputting more consistent light. The fluid can cool a heat sink, printed circuit board, metal plates to which the light emitting diode is mounted, the lens surrounding the light emitting diode, or other heat transferring elements proximate to the light emitting diode.