Point-Like Light Source TRIZ Cases

A thermally conductive electric insulator transfers heat from an AC LED filament to a lamp base electrode, preventing burnout without adding bulky converters.

A sealed LED housing employs a segmented cover and adjustable inner frame to block foreign matter while varying light distribution angles.

A safety protection arrangement measures electrical parameters to detect system failures in lighting systems.

A tubular reflector multiply reflects light through a narrow exit slit to generate high luminance on a moving product web.

A press-formed dome heat sink dissipates LED thermal energy through vertical peak and valley structures.

Annexin derivatives conjugated with polarity-sensitive fluorophores detect phosphatidylserine exposure through intrinsic fluorescence intensity changes.

A light source device combines multiple polarized light fluxes using selective transmission elements to create a unified beam.

A reflection-type light module integrates a heat pipe unit within the lampshade casing to conduct thermal energy away from the light-emitting face.

Recessed lens parts direct light laterally, improving distribution efficiency while reducing device complexity.

A sealed lighting chamber encloses quantum dots within a filling gas containing controlled relative humidity to maintain luminescent stability.

Soldered LED module transfers heat through conductive circuit board layers to a heat sink, eliminating thermal epoxy cure time and premature failure risks.

A vehicle signaling device generates a 3D optical depth effect using a semi-reflective screen and reflector cavity to split light rays.

Mold injection merges capacitor shunts with lamp sockets to eliminate manual labor costs and ensure manufacturing precision.

Attaching dissimilar piggyback substrates to a carrier wafer allows non-Silicon materials to use large-wafer machinery, overcoming size constraints.

A semi-cylindrical heat-dissipation module with arced reflective surfaces directs light from emitting units through a cover.

Vertical stacking and nested structures increase light output while maintaining compact device size and cost.

An LED lamp design uses a specific white to colored light ratio for effective mixing.

Repositioning the electromagnetic coil to wrap around the middle part of the flame sheet reduces structural complexity and manufacturing costs.

Lateral edge discontinuities in the covering layer identify cutting points on opaque modules, enabling accurate length adjustment without front-side visibility.

Conductors merge electrical circuits and thermal paths to dissipate heat from high-power LEDs.

A reverse tapered heatsink widens toward the base to allow unobstructed light propagation from solid state emitters.

Nesting the driver circuit within the socket structure resolves the trade-off between low power consumption and bulky heat sink volume.

Segmented heat dissipation walls with through holes enable convective cooling to prevent luminance degradation in high wattage LED lighting devices.

Segmented modular lighting fixture allows in-place component replacement, reducing maintenance labor and material costs.

A rotatable LED tube lamp adjusts light emission direction by rotating the LED unit relative to fixed bases.

Relocating LEDs to the retention cover eliminates complex reflective paths, enhancing visual aesthetics while simplifying device structure.

Cambered package colloids cover LED chips to eliminate dark bands and ensure uniform light emission.

Modular drum lighting components retrofit existing kits, enabling synchronized interior and exterior visuals without requiring original equipment manufacturing.

A coaxial optical system combines transmissive-refractive and reflecting surfaces to collect divergent light rays efficiently.

Dielectric thin-film stacks tuned to specific incident angles resolve color shifts and intensity losses in LED lighting systems.

Segmented reflector inserts mount independently on the housing to replace light distribution without disturbing the permanently fixed circuit board.

An internal reflective insert in an LED lamp redirects downward light upward, resolving unbalanced illumination caused by direct top-mounted LEDs.

A fluid cooling system stabilizes the p-n junction of light emitting diodes by transferring heat away from the semiconductor.

Wavelength conversion member with periodic conical projections and micro-scatterers enhances excitation light incidence efficiency.

Multi-chip excitation co-excites a phosphor package with a narrow band green phosphor, achieving enhanced luminosity and color rendering.

Segmented PCB layers manage heat dissipation in LED lamps, reducing manufacturing costs associated with metal substrates.

A light source unit merges multiple laser beams using an aspheric reflecting surface and a planar mirror to concentrate optical energy onto a phosphor layer.

A phase change radiator uses latent heat absorption and coolant circulation to cool solid state light sources without bulky passive structures.

Curved metal foil seals electrode axes in short-arc discharge lamps, reducing pressure-induced stress at glass interfaces to prevent cracks.

Segmented heat sink trays resolve the trade-off between thermal dissipation and emitter orientation flexibility in LED fixtures.

Segmented lead frames enable independent testing of light emitting diode packages, reducing soldering spots and increasing yield rates.

Geometric asymmetry in the housing cross-section directs LED light uniformly, eliminating toxic mercury disposal and improving power supply efficiency.

Sliding overlapping LED modules provide customizable lengths, resolving the bottleneck of fixed prefabricated board dimensions.

A lighting apparatus uses a radial heat dissipation chamber to remove thermal energy from light-emitting elements while maintaining optical transmission.

Segmented optical elements with scattering particles suppress glare and dark spots while reducing radiation loss in flat LED surfaces.

Light pipes guide LED radiation to reduce obstruction losses, resolving the trade-off between brightness and power consumption.

Elastic bodies in concave grooves press the lens against side walls, resolving insertion difficulties caused by buffer slip resistance.

A remote thermal compensation circuit board decouples heat management from the primary LED substrate.

A luminous flux control member uses rotationally symmetric linear protrusions to redirect light laterally.

A semiconductor light-emitting device uses a hole electrode to distribute current uniformly across the light-emitting layer.