LED Module Thermal Management via Soldered Circuit Board
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Solution Overview
Problem
Current LED modules face issues such as decreased brightness and lifespan due to heat dissipation challenges, premature failure from thermal epoxies, complexity in assembly, susceptibility to incorrect power source alignment, and electrical interruptions, especially in portable lighting devices like flashlights and headlamps.
Innovation Solution
The LED module incorporates a solder connection between the LED and circuit board, utilizing thermally conductive layers and a heat sink for efficient heat transfer, along with a redundant electrical communication system and anti-polarity features to prevent incorrect power source alignment and enhance mechanical stability and shock resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal epoxy is used to affix the LED to the substrate, then the LED can be attached to the substrate, but the attachment has increased incidence of premature failure and requires extended cure times
Solution Approach 1:
The patent removes the thermal epoxy attachment layer from the LED module structure and replaces it with a direct mechanical and thermal connection system using the circuit board substrate itself as the mounting platform. This extraction eliminates the problematic epoxy cure time and reliability issues while maintaining the necessary thermal and electrical connections.
2Reliability
If thermal epoxy is used to affix the LED, then the LED can be attached, but the attachment exhibits poor thermal, electrical, and mechanical characteristics
Solution Approach 1:
The patent merges the mechanical support, thermal conduction, and electrical connection functions into a single integrated circuit board substrate structure. The substrate simultaneously provides mechanical mounting for the LED, thermal pathways through its construction, and electrical traces for current flow, eliminating the need for separate epoxy attachment layers and improving overall attachment characteristics.
3Ease of manufacture
If conventional LED module assembly is used, then the components can be assembled, but the assembly process is complex
Solution Approach 1:
The circuit board substrate is designed to perform multiple functions simultaneously: mechanical support for the LED and other components, thermal conduction pathway from LED to heat sink, electrical connection through integrated traces, and structural framework for the entire module. This multi-functionality reduces the number of separate components and simplifies the assembly process.
4Temperature
If efficient heat dissipation is implemented, then the LED temperature can be controlled, but additional thermal management components are required
Solution Approach 1:
The thermal management system is merged with the structural support system. The circuit board substrate itself serves as the thermal conduction pathway, with thermally conductive materials integrated into the board construction and direct thermal contact between the LED, substrate, and heat sink. This integration eliminates the need for separate thermal management components while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal, electrical, and mechanical performance, reducing premature failure, allowing for efficient heat dissipation, improved assembly flexibility, and increased reliability against electrical interruptions and mechanical stress.
Implementation Method 1
The first circuit board, which has a plurality of thermally conductive layers connected by thermal vias, promotes the rapid and efficient transfer of heat from the LED to the heat sink
Implementation Method 2
a heat sink formed by an outer housing and a contact ring. The LED and the heat sink are affixed to the first circuit board
Data Source
AI summary
A light emitting diode (“LED”) module with improved thermal characteristics is provided. The module includes an LED, a first circuit board, a second circuit board, a lower insulator, an upper insulator, a lower contact, upper contacts, and a heat sink. Preferably, the heat sink comprises an outer housing and a contact ring. The LED and the heat sink are attached to the first circuit board via solder. In addition to serving as a substrate for the LED, the first circuit board (which contains a plurality of thermally conductive layers connected by vias) facilitates the transfer of heat away from the LED to the heat sink. The module also has improved mechanical and electrical properties, including redundant electrical connections, stable mechanical connections, and a shock-absorbing lower contact. The lower insulator can also be configured to prevent misalignment of the power source with the lower contact when the module is used in a flashlight or other lighting device.