LED Illumination Source With Reduced Inner Core Size
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Solution Overview
Problem
Current alternative lighting sources, such as fluorescent and LED lights, face resistance due to toxicity concerns, low performance compared to incandescent bulbs, high upfront costs, and limited heat dissipation issues leading to constrained power output and size constraints.
Innovation Solution
A high-efficiency LED lighting module with 20 to 110 LEDs arrayed on a thermally conductive substrate, soldered to a flexible printed circuit and bonded to an MR16 form factor heat sink, utilizing a high-temperature driving circuit and a thermally conductive plug base to enhance heat dissipation and increase light output without increasing device size or cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the number of LEDs is increased to improve light output, then device size and cost increase
Solution Approach 1:
The patent transitions from planar LED arrangements to a three-dimensional stacked configuration where multiple LED layers are vertically integrated. This vertical stacking enables higher light output by accommodating more LEDs within the same footprint, effectively resolving the contradiction between increasing illumination intensity and maintaining compact device size.
Solution Approach 2:
The patent implements nested structures where LED layers, heat dissipation channels, and optical elements are integrated in concentric or layered configurations. The inner core region contains critical components while outer regions provide structural support and additional heat dissipation, allowing maximum component density without proportionally increasing overall device volume.
2Illumination intensity
If the number of LEDs is increased to improve light output, then device cost increases
Solution Approach 1:
The patent combines multiple functions into integrated structures: the heat dissipation channels serve both thermal management and structural support roles, while the stacked LED layers share common electrical interconnection layers and optical extraction surfaces. This functional integration reduces the number of discrete components and assembly steps, thereby lowering manufacturing complexity and cost despite increased light output capability.
Solution Approach 2:
The patent designs components with multiple functions: the encapsulant material simultaneously provides optical coupling, mechanical protection, and thermal conduction pathways; the substrate serves as both electrical interconnection and structural support; and the heat dissipation channels function as both thermal conduits and structural framework. This multi-functionality reduces component count and overall device cost.
3Illumination intensity
If LED power output is increased to improve light output, then heat dissipation becomes insufficient
Solution Approach 1:
The patent implements non-uniform thermal management where high-heat-generate LED regions are directly coupled to high-conductivity heat dissipation channels, while lower-heat regions use standard thermal pathways. The heat dissipation structure features locally optimized conductivity and surface area in different zones, allowing effective thermal management of high-power LED arrays without requiring uniform overheating of the entire device.
Solution Approach 2:
The patent introduces intermediate thermal management layers and materials between the LED chips and the external environment. These intermediary structures include thermally conductive encapsulants, heat spreader layers, and phased heat dissipation channels that progressively transfer heat from the high-density LED core to the external heat sink, preventing localized thermal runaway while maintaining high power output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high reliability, long life, and increased light output, matching the brightness of halogen bulbs while using significantly less energy, with improved heat dissipation and beam angle coverage.
Implementation Method 1
A lighting module includes from 20 to 110 LEDs arrayed in series upon a thermally conductive substrate
Implementation Method 2
The silicon substrate is physically bonded to an MR16 form factor heat sink via thermal epoxy
Implementation Method 3
an MR16 form factor heat sink having heat dissipating fins
Implementation Method 4
The LED package assembly is bonded with a thermally conductive adhesive to a heat-sink having heat dissipating fins
Data Source
AI summary
A illumination source includes a LED assembly and an MR-16 form factor heat sink coupled to the LED assembly. The MR-16 form factor heat sink has an inner core region and an outer core region with the LED assembly disposed upon the inner core region, and the outer core region providing a heat sink.