LED Chip Package with Cambered Colloid for Uniform Light
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Solution Overview
Problem
Existing LED chip packaging methods are time-consuming, prone to dark band formation, and inefficient in heat dissipation, leading to suboptimal light emission and potential overheating of LED chips due to limited substrate thickness.
Innovation Solution
An LED chip package structure with continuous light-generating areas is achieved by arranging LED chips on a substrate with adhesive or hot pressing, using cambered package colloids and frame layers to prevent dark bands and enhance heat dissipation, allowing for efficient light emission and vertical application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED chips are packaged separately and arranged on substrate via SMT process, then electrical connection is achieved, but the packaging process is time-consuming and dark bands are produced between fluorescent colloids
Solution Approach 1:
The patent merges the LED chip mounting and fluorescent colloid packaging into a single integrated structure. The fluorescent colloid is designed to simultaneously package multiple LED chips and fill the spaces between them, eliminating the need for separate SMT packaging steps and preventing dark band formation between individually packaged colloids.
Solution Approach 2:
The patent segments the fluorescent colloid into multiple regions that correspond to different LED chip positions. By dividing the colloid into distinct packaging zones with appropriate triggering areas, the patent achieves both efficient light emission from each LED chip and continuous light output without dark bands, while simplifying the manufacturing process.
2Stability of the object's composition
If longitudinal package colloid is used to cover LED chips, then dark bands are prevented, but the triggered area is not uniform causing uneven light emission
Solution Approach 1:
The patent applies different triggered area ratios to different regions of the fluorescent colloid. Specifically, the colloid closer to the LED chips has a larger triggered area ratio to ensure strong light emission, while regions farther away have adjusted triggered areas to maintain uniformity. This local variation in colloid properties ensures both continuous light output without dark bands and uniform overall light emission.
3Length of moving object
If base length is shortened to fit thin light-guiding board, then application to thin casings is enabled, but heat dissipation effect is insufficient causing LED chip damage
Solution Approach 1:
The patent transitions from one-dimensional heat dissipation (along the base length) to two-dimensional heat dissipation by incorporating a heat dissipation structure with extended surfaces in the vertical dimension. The heat dissipation structure includes a base portion and extended heat dissipation fins that increase the heat dissipation surface area without increasing the base length, enabling effective heat dissipation in thin casing applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method simplifies the manufacturing process, eliminates dark bands, ensures uniform light emission, and provides effective heat dissipation, making it suitable for various light sources and thin casings.
Implementation Method 1
each package colloid being cut into two half package colloids, each half package colloid having a half cambered colloid surface and a rough light-emitting colloid surface formed in front of its cambered colloid surface
Implementation Method 2
because the LED chips are arranged on a substrate body via an adhesive or a hot pressing method
Implementation Method 3
because the LED chips are arranged on a substrate body via an adhesive or a hot pressing method
Implementation Method 4
each longitudinal package colloid having a plurality of cambered colloid surfaces that are formed on its top side and correspond to the LED chips
Data Source
AI summary
An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.