Remote Thermal Compensation Circuit for LED Lighting
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Solution Overview
Problem
Current LED light bulb configurations, where thermal compensation circuits are integrated with the LED board, face limitations in productivity, production flexibility, and packaging constraints, restricting LED placement, adding complexity to the optical deck, and complicating standardization.
Innovation Solution
The thermal compensation circuitry is positioned remotely from the LED board, allowing for separate and independent design and placement, which alleviates packaging constraints, increases LED board space, and enables standardization of thermal compensation circuitry across various LED lighting devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermal compensation circuitry is integrated with the LED board, then circuit connectivity is ensured, but packaging constraints increase and LED placement flexibility decreases
Solution Approach 1:
The patent divides the thermal compensation circuitry from the LED board into separate components. The LED board contains only LED elements while the thermal compensation circuitry is placed on a separate circuit board, allowing independent optimization of each component's layout and function.
Solution Approach 2:
The thermal compensation circuitry is extracted from the LED board and positioned remotely on a separate circuit board. This extraction eliminates packaging constraints on the LED board and allows flexible LED placement without being limited by circuit routing requirements.
2Device complexity
If thermal compensation circuitry is integrated with the LED board, then assembly is simplified, but production flexibility and productivity are limited
Solution Approach 1:
By segmenting the thermal compensation circuitry from the LED board, the patent enables independent manufacturing and testing of each component. This allows parallel production processes and facilitates quality control, ultimately improving overall productivity despite the increased number of components.
Solution Approach 2:
The separate thermal compensation circuit board can be designed as a universal component that can be adapted to different LED board configurations and lighting applications, increasing production flexibility and reducing the need for custom-designed integrated circuits for each application.
3Quantity of substance
If thermal compensation circuitry is integrated with the LED board, then component count is reduced, but design flexibility and standardization are compromised
Solution Approach 1:
The separate thermal compensation circuit board can be standardized as a universal component that interfaces with various LED board designs. This standardization approach increases adaptability across different lighting products while maintaining the benefits of separated functionality.
Solution Approach 2:
By moving the thermal compensation circuitry to a separate dimension (a different circuit board layer or separate board), the patent enables independent design optimization without increasing the footprint on the LED board, thereby maintaining design flexibility.
4Area of stationary object
If thermal compensation circuitry is positioned remotely, then LED board space increases, but electrical connection complexity increases
Solution Approach 1:
The thermal compensation circuitry is extracted and placed on a separate circuit board that can be positioned remotely from the LED board. This extraction simplifies the LED board design by removing circuit routing constraints, and the electrical connections between the two boards can be managed through standardized connectors or trace routing on a carrier board.
Data Source
AI summary
A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided.