Semi-cylindrical Heat-dissipation Module for LED Illumination

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Solution Overview

Problem

LED-based illumination devices face challenges with heat dissipation, as traditional methods like fans result in bulkiness and increased costs, while passive heat sinks compromise efficiency.

Innovation Solution

A heat-dissipation module with a semi-cylindrical, hollow main body made of conductive materials like aluminum or copper, combined with saw-toothed micro-structures on the cover and arced reflective surfaces, enhances heat dissipation and light distribution for even illumination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a fan is employed for heat dissipation, then heat dissipation efficiency is improved, but the device becomes bulky and expensive

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice bulkiness and cost

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent extracts the active cooling mechanism (fan) from the system and replaces it with a passive heat dissipation structure. The heat-dissipation module uses conductive materials and geometric features (protrusions, reflective surfaces) to dissipate heat without mechanical components, thereby eliminating bulkiness and cost associated with fans while maintaining heat dissipation efficiency.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical cooling system (fan) with a thermal conduction-based passive heat dissipation system. The heat-dissipation module uses thermally conductive materials and geometric structures to transfer and dissipate heat through conduction and radiation, substituting mechanical action with thermal physics principles.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Device complexity

If a passive heat sink is employed for heat dissipation, then device complexity is reduced, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvedevice simplicityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The patent applies local quality by creating non-uniform thermal pathways within the heat-dissipation module. Protrusions are strategically positioned to create localized heat transfer zones, and reflective surfaces are placed to direct heat radiation. This localized optimization enhances overall heat dissipation efficiency while maintaining passive operation and structural simplicity.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs curved and geometric features (protrusions, arced reflective surfaces) on the heat-dissipation module to increase surface area and optimize heat radiation patterns. These geometric modifications enhance thermal performance without adding mechanical complexity, resolving the contradiction between simplicity and efficiency.

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Device complexity

If traditional heat dissipation methods are used, then device structure is simple, but illumination uniformity deteriorates

Engineering Contradiction:

Improvestructural simplicityVSAvoidillumination uniformity

Core Design Contradiction:

Device complexityVSIllumination intensity

Solution Approach 1:

The heat-dissipation module serves multiple functions simultaneously: it dissipates heat through conduction and radiation, and it shapes light distribution through its geometric features and reflective surfaces. This multi-functionality achieves uniform illumination without adding separate optical components, maintaining structural simplicity while improving illumination quality.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the heat dissipation function with the light distribution function into a single integrated module. The same structural features (protrusions, reflective surfaces) that enhance heat dissipation also shape and distribute light uniformly, combining multiple functions without increasing device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively increases heat dissipation efficiency and achieves more uniform illumination while maintaining a compact design, addressing the limitations of traditional heat dissipation methods.

Implementation Method 1

A heat-dissipation module with a semi-cylindrical, hollow main body made of conductive materials like aluminum or copper

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

arced reflective surfaces, enhances heat dissipation and light distribution for even illumination

Methodology Applied

Scientific EffectLight reflection: Reflection

Data Source

PatentUS8267549B2Illumination device

Publication Date: 2012.09.18 SIGNIFY HOLDING BV

AI summary

An illumination device includes a cover, a heat-dissipation module, and a plurality of light emitting units. The heat-dissipation module includes a main body and a mounting plate connected to the main body. The mounting plate is received in the interior of the illumination device. The light emitting units are mounted on the mounting plate and opposite to the cover. Light from the light emitting unit is transmitted through the cover.