Modular LED Lighting Device Cutting Markers
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Solution Overview
Problem
Modular LED lighting devices with opaque materials present challenges in identifying cutting points, as they are not visible from the front or top side, making it difficult to cut the module to length without visible reference points, especially when the top or front side is completely masked.
Innovation Solution
Incorporating discontinuities in the covering layer on the bottom or back side of the module, which act as regular markers for cutting, allowing the module to be cut to length without visible reference points on the front or top side, and enabling alignment with the circuit layout for accurate positioning and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If opaque materials are used to protect the module, then the module is protected and no transparent materials are used, but the cutting points become unrecognizable and cannot be identified through direct observation
Solution Approach 1:
The patent moves the cutting point identification from the front observation dimension to the lateral edge dimension. By placing visible markers on the lateral edges of the PCB, the cutting points become observable from the side rather than requiring transparency of the front protective materials.
Solution Approach 2:
The patent introduces lateral edge markers as intermediary visual elements that mediate between the opaque protective materials and the cutting point information. These markers serve as a visible interface that allows cutting point identification without requiring the protective materials to be transparent.
2Reliability
If the top or front side of the module is completely masked or covered, then the module is protected, but there are no visible reference points for cutting
Solution Approach 1:
The patent relocates the reference points for cutting from the masked front surface to the lateral edges of the module. This dimensional shift allows workers to perform cutting operations using visible markers on the sides, maintaining front surface protection while enabling easy cutting operations.
3Difficulty of detecting and measuring
If marking is used to indicate cutting points, then cutting points can be identified, but alignment issues arise due to tolerances, shrinkage, and positioning requirements
Solution Approach 1:
The patent combines the cutting point markers with the PCB edge structure itself, rather than applying separate markings to the front surface. The markers are integrated into the lateral edges during PCB manufacturing, ensuring automatic alignment with the circuit board geometry and eliminating separate alignment steps.
Solution Approach 2:
The cutting point markers are positioned and fixed during the PCB manufacturing process before final assembly. This preliminary placement ensures that the markers maintain precise alignment with the cutting points throughout subsequent manufacturing steps, eliminating alignment issues that would arise from later marking operations.
Data Source
Figure 1~3
AI summary
A modular lighting device (10) includes an elongated support member (16) with electrically powered light radiation sources (12). The support member (16) includes at least one electrically conductive layer (20) with a covering layer (18) applied thereon, wherein said covering layer (18) exhibits discontinuities (20) forming a marker array for cutting to length modular lighting device (10).