Fluid-Jet Die Street Singulation for Thinned Semiconductor Substrates
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Solution Overview
Problem
Existing semiconductor substrate singulation processes face challenges in efficiently and accurately separating semiconductor die while minimizing stress and cracking, particularly in thinned substrates.
Innovation Solution
The use of fluid jets or laser beams to singulate semiconductor die by moving along die streets, employing various singulation paths such as alternating, multi-pass, simultaneous, zigzag, and intersecting techniques, which can include pulsing and using particles or etchants, to reduce stress and improve accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional singulation methods are used to separate semiconductor die, then die can be separated from the substrate, but die chipping and cracking occur due to stress and strain during the process
Solution Approach 1:
The patent replaces conventional mechanical singulation methods (such as sawing or breaking) with a fluid jet system that uses high-velocity liquid to erode and separate the die streets. This substitution eliminates mechanical contact and associated stress concentrations that cause chipping and cracking, while maintaining precise die separation through controlled fluid jet positioning and motion along the die streets
Solution Approach 2:
The patent employs a fluid jet (hydraulic system) to deliver high-velocity liquid along the die streets for material removal and die separation. The fluid jet system uses pressurized liquid flow to erode the substrate material between dies, enabling stress-free singulation that preserves die integrity while achieving complete separation
2Productivity
If singulation processes are applied to thinned semiconductor substrates, then throughput can be improved, but stress and cracking increase due to the reduced substrate thickness
Solution Approach 1:
The patent replaces mechanical singulation methods with a fluid jet system that exerts minimal force on thinned substrates. The high-velocity fluid erodes material through abrasion and hydrodynamic forces rather than mechanical contact, enabling safe processing of thinned substrates that would be vulnerable to stress from conventional mechanical methods
Solution Approach 2:
The patent employs pulsed or periodic fluid jet application along the die streets, allowing controlled material removal without accumulating excessive stress in thinned substrates. The periodic action enables manageable stress cycles that prevent cracking while maintaining efficient throughput for singulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These methods effectively minimize die chipping and cracking by reducing strain during singulation, enhancing throughput and precision, especially for thinned semiconductor substrates.
Implementation Method 1
applying a fluid jet to a material of a die street... singulating the plurality of die and the plurality of die support structures at the plurality of die streets using the fluid jet
Implementation Method 2
The fluid jet may include a plurality of particles
Implementation Method 3
applying a one of a fluid jet or a laser beam to a material of a die street... singulating the plurality of die and a plurality of die support structures
Data Source
AI summary
Implementations of a semiconductor substrate singulation process may include applying a fluid jet to a material of a die street of a plurality of die streets included in a semiconductor substrate where the semiconductor substrate may include: a plurality of die separated by the plurality of die streets; and a plurality of die support structures coupled thereto; and singulating the plurality of die and the plurality of die support structures at the plurality of die streets using the fluid jet. The fluid jet may be moved only along a length of the die street.