Fluid-Permeable Cooler Structure for Low-Resistance Power Module Cooling
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Solution Overview
Problem
Existing power modules in power electronics face challenges in efficiently dissipating high heat generation due to high thermal resistance between semiconductors and coolants, which can lead to failure from excessive temperatures.
Innovation Solution
A fluid-permeable cooler with interconnected metal parts and a cooling structure, featuring a first metal part with a higher expansion coefficient than the power substrate, ensures elastic deformation and efficient heat transfer, using a soldering process to connect metal parts and a cooling structure with high thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal part with high thermal conductivity is used for the cooler, then heat dissipation performance is improved, but thermal expansion mismatch with the power substrate causes deformation and potential failure
Solution Approach 1:
The patent changes the material parameter (yield strength) of the metal part by selecting specific high-strength aluminum alloys or copper alloys, ensuring that the metal part can withstand thermal stress without plastic deformation while maintaining high thermal conductivity for effective heat dissipation
Solution Approach 2:
The patent employs composite material strategies by using metal alloys with specifically optimized compositions that combine high thermal conductivity with appropriate mechanical properties, creating a material system that balances thermal performance and dimensional stability under thermal cycling conditions
2Strength
If the metal part is made more rigid to prevent deformation, then structural stability is improved, but thermal stress from differential expansion increases and may cause solder joint failure
Solution Approach 1:
The patent optimizes the yield strength parameter of the metal part to a specific range that provides sufficient structural stability while allowing controlled elastic deformation to accommodate thermal expansion differences, preventing both plastic deformation and solder joint failure
Solution Approach 2:
The patent designs the metal part with pre-calculated elastic deformation capacity that acts as a cushioning mechanism, absorbing thermal stress through controlled elastic strain before it can transmit to the solder joints, thereby protecting the connection reliability
3Temperature
If the cooler design is optimized for maximum cooling efficiency, then thermal resistance is reduced, but the complexity of the cooler structure increases
Solution Approach 1:
The patent divides the cooler into functionally distinct segments: a metal part for thermal conduction and mechanical stability, a soldering layer for reliable joining, and a cooling structure for heat dissipation, allowing each segment to be optimized independently for its specific function
Solution Approach 2:
The patent applies different material properties and structural characteristics to different regions of the cooler - the metal part uses high-strength alloy composition for mechanical performance, while the cooling structure uses high thermal conductivity materials and geometries optimized for heat transfer, achieving maximum cooling efficiency without uniform complexity throughout
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes thermal resistance and prevents plastic deformation, enabling efficient heat dissipation and cooling performance, even under cyclic thermal loads.
Implementation Method 1
The first metal part and the second metal part are interconnected by means of a soldering process
Implementation Method 2
The first metal part and the second metal part define a cooling channel through which a fluid can flow and in which the cooling structure is located
Implementation Method 3
a fluid-permeable cooler for cooling a power module having a power substrate comprising a first metal part, a second metal part and a cooling structure
Implementation Method 4
The first metal part is made from a metal material which has an expansion coefficient that is greater than the expansion coefficient of the power substrate, so that heat-induced expansion of the first metal part is reduced
Implementation Method 5
Prior to the soldering process, the first metal part may advantageously be a metal part pre-plated with a soldering layer, in particular a roll-plated metal part
Data Source
AI summary
The present invention relates to a fluid-permeable cooler (100) for cooling a power module (208) that comprises a power substrate. The fluid-permeable cooler (101) comprises a first metal part (101), a second metal part (102) and a cooling structure (1). The first metal part (101) and the second metal part (102) are interconnected by means of a soldering process and define a cooling channel (111) which is permeable by a fluid and in which the cooling structure (1) is located.The first metal part (101) comprises a receiving region (109) to which the power module (208) can be attached. The first metal part (101) is made from a metal material which has an expansion coefficient that is greater than the expansion coefficient of the power substrate (208). The invention also relates to a power electronics assembly (1000) having a cooler (100) of this kind and a power module (200).