Fluid-Sealed Heat Sink Plate Layout for Cooler Semiconductor Modules
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Solution Overview
Problem
Semiconductor modules face challenges in effectively dissipating the heat generated by power semiconductor elements, leading to excessive temperature increases due to inefficient thermal conduction.
Innovation Solution
Incorporating a heat sink plate with a sealed fluid inside, which enhances thermal conduction anisotropy and diffuses heat evenly across the substrate, while reducing impedance through terminal placement and using materials like copper or graphite for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional substrate structure is used without specialized heat dissipation components, then the device complexity is low, but the temperature rise of semiconductor elements becomes excessive
Solution Approach 1:
The substrate integrates multiple functions: it provides mechanical support, electrical insulation, and heat dissipation through an embedded heat sink plate. The heat sink plate is positioned in thermal contact with the semiconductor element's back surface, creating a unified structure that simultaneously supports and cools the device without requiring separate mounting components.
Solution Approach 2:
The heat sink plate acts as an intermediary between the semiconductor element and the external environment. It receives heat from the semiconductor element through thermal conduction and transfers it to the surrounding fluid or air, effectively mediating the heat transfer process and preventing excessive temperature rise in the semiconductor element.
2Loss of energy
If heat is not effectively dissipated, then the device structure remains simple, but the thermal conduction efficiency becomes insufficient
Solution Approach 1:
The substrate's thermal properties are enhanced by incorporating a heat sink plate with high thermal conductivity material. This changes the thermal conduction parameter of the substrate, enabling more efficient heat transfer from the semiconductor element to the surrounding environment, thereby improving heat dissipation efficiency without complicating the overall device structure.
3Quantity of substance
If multiple semiconductor elements are mounted on a single substrate, then the device integration is high, but the heat dissipation capacity becomes insufficient
Solution Approach 1:
The heat dissipation function is segmented from the mechanical support function. The heat sink plate is positioned specifically beneath the semiconductor element that generates the most heat, allowing targeted heat dissipation. This segmentation enables the substrate to support multiple semiconductor elements while providing dedicated thermal management for each high-power component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively diffuses heat generated by semiconductor elements, suppresses temperature rise, and reduces impedance in the current path, enhancing cooling performance and maintaining control circuit functionality.
Implementation Method 1
enhances thermal conduction anisotropy and diffuses heat evenly across the substrate
Implementation Method 2
A fluid is sealed inside the heat sink plate
Data Source
AI summary
A semiconductor module includes a substrate, a semiconductor element and a heat sink plate. The substrate is included in a circuit board. The semiconductor element is disposed at the heat sink plate inside the substrate. A fluid is sealed inside the heat sink plate.