Fluidic Pick-Up Head for Semiconductor Transfer
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Solution Overview
Problem
Conventional pick and place techniques for small semiconductor devices like micro-LEDs are unsuitable due to limitations in serial operation, potential for physical damage, and risk of electrostatic discharge, especially when handling ESD-sensitive devices.
Innovation Solution
A pick-up head array using a fluidic material as a transfer medium, where a fluidic membrane is formed on the tip of each pick-up head to attach and detach semiconductor devices from a carrier substrate to a target substrate, allowing for simultaneous pickup and placement without direct contact, thus reducing damage risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional vacuum pick-up tools are used, then individual devices can be picked and placed, but the operation is limited to serial pick and place of individual devices
Solution Approach 1:
The pick-up head is segmented into multiple independent pickup elements arranged in an array, allowing simultaneous pickup of multiple devices at different positions. Each element can independently form a fluidic membrane and capture a device, enabling parallel operations that dramatically increase productivity while maintaining manageable system complexity through modular design
Solution Approach 2:
The fluidic membrane maintains continuous contact with the device surfaces throughout the transfer process, allowing uninterrupted pickup and placement operations. The membrane can be rapidly formed and released in sequence across multiple elements, enabling continuous high-speed transfer without the need for repeated system reconfiguration or complex mechanical adjustments
2Reliability
If transfer printing with direct contact under high pressure is used, then devices can be picked and placed, but the pick-up heads have limited work life or physical damage to the devices
Solution Approach 1:
A fluidic membrane serves as an intermediary between the pick-up head and the device, eliminating direct mechanical contact. The membrane deforms to conform to device surfaces and maintains contact through surface tension and adhesion forces rather than high pressure, preventing physical damage to both the devices and extending the work life of the pick-up heads
Solution Approach 2:
The mechanical pressure-based contact system is replaced with a fluidic adhesion-based system. Instead of applying high mechanical pressure through rigid contact, the system uses the adhesive properties of the fluidic membrane and surface tension to hold devices, significantly reducing mechanical stress and damage risk
3Productivity
If electrostatic forces are used to pick and transfer LEDs, then devices can be transferred, but there is potential to damage electrostatic discharge (ESD) sensitive devices
Solution Approach 1:
The fluidic membrane acts as an intermediary that eliminates direct electrostatic interaction between the pick-up head and the device. Adhesion is achieved through surface tension and wetting properties of the fluid rather than electrostatic forces, completely avoiding ESD damage risk while maintaining efficient transfer capability
Solution Approach 2:
The system uses fluidic (hydraulic) principles to achieve device attachment and release. By controlling the presence and pressure of the fluidic membrane, the system can reliably pick up and release devices through pressure-driven fluid dynamics rather than electrostatic forces, ensuring ESD-safe operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, parallel pick and place operations for multiple semiconductor devices, minimizing damage and improving manufacturing efficiency by using a fluidic material that acts as a transfer medium, reducing the likelihood of physical or electrostatic damage during the transfer process.
Implementation Method 1
A first amount of fluidic material is released from a tip of a pick-up head to form a fluidic membrane on the tip. The fluidic membrane is brought on the tip of the pick-up head in contact with a semiconductor device on a carrier substrate to attach the semiconductor device to the fluidic membrane.
Implementation Method 2
The fluidic membrane is brought on the tip of the pick-up head in contact with a semiconductor device on a carrier substrate to attach the semiconductor device to the fluidic membrane.
Implementation Method 3
A second amount of the fluidic material is released from the tip of the pick-up head to separate the semiconductor device from the pick-up head and place the semiconductor device on a target substrate.
Data Source
AI summary
A method and system for manufacturing a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using fluidic material as a transfer medium. The method may include releasing a first amount of fluidic material from a tip of a pick-up head to form a fluidic membrane on the tip, and bringing the fluidic membrane on the tip of the pick-up head in contact with a semiconductor device on a carrier substrate to attach the semiconductor device to the fluidic membrane. The method can further include releasing a second amount of the fluidic material from the tip of the pick-up head to separate the semiconductor device from the pick-up head and place the semiconductor device on a target substrate.