Fluoride-Based Resin Prepreg for High-Frequency Circuit Substrates
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Solution Overview
Problem
Current fluoride-based resins, such as PTFE, face processing difficulties due to high melting points and low flowability, leading to increased processing temperatures and porosity in high-frequency circuit substrates, which affect yield and thermal expansion differences.
Innovation Solution
A fluoride-based resin prepreg with a reinforced base layer and a fluoride-based resin layer containing 10 to 80 wt% PTFE, 10 to 50 wt% FEP, and 0.1 to 40 wt% PFA, along with an inorganic filler, which improves flowability and filling properties, reducing the pressing temperature to 240° C. to 300° C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PTFE is used as the main component of fluoride-based resin, then the dielectric constant and dielectric dissipation factor are reduced, but the melting point and melt viscosity increase, leading to low flowability
Solution Approach 1:
The patent uses a composite resin system combining PTFE (10-80 wt%), FEP (10-50 wt%), and PFA (0.1-40 wt%). This composite approach allows the material to maintain the low dielectric properties of PTFE while incorporating FEP and PFA which have lower melting points and better flow characteristics, thus resolving the contradiction between dielectric performance and manufacturability
Solution Approach 2:
The patent modifies the resin composition parameters by controlling the specific weight percentages of PTFE, FEP, and PFA. By adjusting these compositional parameters, the material achieves an optimal balance between maintaining low dielectric constant and dissipation factor while improving flowability and reducing melting point for better processability
2Manufacturing precision
If pressing temperature is increased to improve flowability of PTFE, then the filling property improves, but the processing difficulty increases due to high temperature requirements
Solution Approach 1:
The patent changes the thermal parameters of the resin system by incorporating FEP and PFA which have lower melting points than PTFE. This allows the pressing process to be conducted at lower temperatures (reducing processing difficulty) while still achieving adequate flowability and filling properties for high density circuits
3Reliability
If PTFE is used for high frequency substrates, then the dielectric properties are improved, but porosity occurs between circuit layers due to low flowability
Solution Approach 1:
The composite resin system combines PTFE (for low dielectric constant and dissipation factor) with FEP and PFA (for improved flowability). This combination ensures that the resin can properly fill and wet the circuit layers during pressing, eliminating porosity while maintaining the low dielectric properties necessary for high frequency applications
Solution Approach 2:
By adjusting the compositional parameters of the resin system (specifically incorporating 10-50 wt% FEP and 0.1-40 wt% PFA), the patent improves the flow characteristics and filling properties of the resin, ensuring complete impregnation of circuit layers without porosity while maintaining the low dielectric properties of the PTFE-based system
4Ease of manufacture
If pressing temperature is reduced to decrease processing difficulty, then the flowability improves, but the filling property deteriorates with conventional PTFE
Solution Approach 1:
The patent employs a composite resin system where FEP and PFA components compensate for the low flowability of PTFE at lower temperatures. This allows the pressing process to be conducted at reduced temperatures (improving ease of manufacture) while the composite formulation ensures adequate flow and filling properties are maintained for proper circuit layer impregnation
Data Source
AI summary
A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.