Fluorinated Aromatic Resin Composition for Low Permittivity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photosensitive materials for electronics face challenges such as high permittivity, water absorption, and low heat resistance, which affect the performance and productivity of devices, particularly in the formation of patterns during the dehydration process of polyimide and polybenzoxazole rings, and the softening temperature of polybenzocyclobutene.
Innovation Solution
A negative photosensitive fluorinated aromatic resin composition is developed, comprising a fluorinated aromatic prepolymer obtained through a condensation reaction of compounds with crosslinkable functional groups and phenolic hydroxyl groups, in the presence of a HF-removing agent, along with a photosensitizer and solvent, to create a film with low permittivity, low water absorption, and high heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyimide is used as a photosensitive material, then heat resistance and mechanical strength are improved, but permittivity and water absorption increase
Solution Approach 1:
The patent changes the chemical composition parameters by introducing fluorinated aromatic rings and specific functional groups (crosslinkable functional groups A, phenolic hydroxyl groups) to modify the material's electrical and physical properties. This transforms polyimide into a fluorinated aromatic resin composition that maintains heat resistance while reducing permittivity and water absorption through fluorine substitution and molecular structure optimization
Solution Approach 2:
The patent creates a composite material system combining multiple components: fluorinated aromatic prepolymer, crosslinkable functional groups, phenolic hydroxyl groups, and photosensitizers. This composite structure integrates the benefits of different molecular components to achieve both heat resistance and low permittivity/water absorption simultaneously
2Reliability
If polybenzoxazole is used as a photosensitive material, then permittivity and water absorption are improved, but heat resistance decreases
Solution Approach 1:
The patent modifies the molecular structure by introducing fluorinated aromatic rings and crosslinkable functional groups that enhance thermal stability. The condensation reaction process and specific molecular weight control (1×10³ to 5×10⁵) create a material that maintains low permittivity and water absorption while significantly improving heat resistance compared to conventional polybenzoxazole
3Reliability
If polybenzocyclobutene is used as a photosensitive material, then permittivity and water absorption are improved, but softening temperature decreases
Solution Approach 1:
The patent changes the molecular structure by incorporating fluorinated aromatic rings and crosslinkable functional groups that increase thermal stability. The condensation reaction and molecular weight control parameters ensure the material maintains low permittivity and water absorption while achieving a softening temperature suitable for industrial applications
Solution Approach 2:
The patent creates a composite structure combining fluorinated aromatic prepolymer with crosslinkable functional groups and phenolic hydroxyl groups. This composite material system provides both the desired electrical properties (low permittivity, low water absorption) and improved thermal stability through the synergistic effect of different molecular components
4Temperature
If dehydration is accompanied during forming imide ring, then heat resistance is improved, but processing time increases
Solution Approach 1:
The patent changes the chemical reaction parameters by using a condensation reaction with HF-removing agent instead of traditional dehydration. This alternative chemical pathway forms the imide ring structure with reduced processing time while maintaining heat resistance, effectively resolving the contradiction between thermal stability and manufacturing efficiency
5Productivity
If temperature is suddenly increased to desired curing temperature, then productivity is improved, but pattern shape deformation occurs
Solution Approach 1:
The patent modifies the thermal processing parameters by controlling the heating rate and introducing a photosensitizer that enables crosslinking at lower temperatures. This allows the material to undergo crosslinking reaction without requiring sudden temperature increases, thereby maintaining pattern shape accuracy while improving productivity through optimized curing conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for the formation of a resin film with improved electrical characteristics, enhanced reliability, and flexibility, reducing the risk of damage from moisture and heat, while eliminating the need for a resist layer in the photo-lithography process, thus improving productivity.
Implementation Method 1
a fluorinated aromatic prepolymer which is obtained by subjecting either one or both of a compound (Y-1) having a crosslinkable functional group (A) and a phenolic hydroxyl group and a compound (Y-2) having a crosslinkable functional group (A) and a fluorinated aromatic ring, to a condensation reaction
Implementation Method 2
a negative photosensitive fluorinated aromatic resin composition comprising the following fluorinated aromatic prepolymer, at least one photosensitizer and at least one solvent
Data Source
AI summary
To provide a negative photosensitive fluorinated aromatic resin composition having a low relative permittivity, low water absorptivity, high heat resistance and high productivity.A negative photosensitive fluorinated aromatic resin composition comprising the following fluorinated aromatic prepolymer, a photosensitizer and a solvent. Here the fluorinated aromatic prepolymer is a fluorinated aromatic prepolymer which is obtained by subjecting either one or both of a compound (Y-1) having a crosslinkable functional group (A) and a phenolic hydroxyl group, and a compound (Y-2) having a crosslinkable functional group (A) and a fluorinated aromatic ring, to a condensation reaction in the presence of a HF-removing agent, with a fluorinated aromatic compound (B) represented by the following formula (1):(wherein n is an integer of from 0 to 3, each of a and b which are independent of each other, is an integer of from 0 to 3, each of Rf1 and Rf2 is a fluorinated alkyl group having at most 8 carbon atoms, and F in the aromatic ring represents that hydrogen atoms of the aromatic ring are all substituted by fluorine atoms), and a compound (C) having at least 3 phenolic hydroxyl groups, and which has crosslinkable functional groups (A) and ether bonds and has a number average molecular weight of from 1×103 to 5×105.