Fluorinated Resin Composition for LED Encapsulation

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Solution Overview

Problem

Existing encapsulating agents for light-emitting devices, such as those disclosed in Patent Literature 1, require additional encapsulating members for adequate encapsulation and heat resistance, reducing efficiency and necessitating further encapsulation steps.

Innovation Solution

A resin composition comprising polymers with specific structural units, including perfluoroalkyl groups and functional groups like carbonyl-containing, hydroxyl, epoxy, or cyano groups, which form a robust encapsulating member with high heat resistance and encapsulation performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If fluorinated polymers are used as encapsulating agent, then resistance to short-wavelength light degradation is improved, but encapsulation performance is insufficient requiring additional encapsulating members

Engineering Contradiction:
Improveresistance to short-wavelength light degradationVSAvoidnumber of encapsulating members
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies composite materials by combining fluorinated polymer units (for UV resistance) with functional groups (carboxyl, hydroxyl, epoxy, isocyanate, or cyano groups) in a single encapsulating resin composition. This composite approach maintains resistance to short-wavelength light degradation while achieving adequate encapsulation performance alone, eliminating the need for additional encapsulating members.

Inventive Principle:
Principle #40Composite materials

2Temperature

If additional encapsulating members are used to achieve high heat resistance, then heat resistance is improved, but production efficiency decreases

Engineering Contradiction:
Improveheat resistanceVSAvoidproduction efficiency
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent merges multiple functions (UV resistance, heat resistance, and encapsulation performance) into a single resin composition. By incorporating functional groups with specific thermal properties alongside fluorinated polymer units, the composition achieves high heat resistance without requiring additional encapsulating members, thereby maintaining production efficiency.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If epoxy resins or silicone resins are used as encapsulating member, then ease of manufacture is improved, but resistance to short-wavelength light degradation deteriorates

Engineering Contradiction:
Improveease of encapsulationVSAvoidresistance to short-wavelength light degradation
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the chemical composition parameters by using fluorinated polymer units as the base, which inherently provide resistance to short-wavelength light degradation. The functional groups are selected to ensure ease of manufacture and encapsulation, thus achieving both ease of manufacture and resistance to degradation through compositional parameter optimization.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20220262692A1Resin composition for encapsulating light-emitting device, light source unit, and method for manufacturing light source unit
Publication Date: 2022.08.18 NITTO DENKO CORP
  • US20220262692A1 patent drawing
  • US20220262692A1 patent drawing
  • US20220262692A1 patent drawing

AI summary

The present invention provides a resin composition for producing an encapsulating member having high heat resistance and high encapsulation performance. In the resin composition for encapsulating a light-emitting device according to the present invention, at least one of (i) and (ii) is satisfied:(i) the resin composition includes a polymer (P1) including: a structural unit (A) represented by the following formula (1); and a structural unit (B) having at least one functional group selected from the group consisting of a carbonyl-containing group, a hydroxyl group, an epoxy group, an isocyanate group, and a cyano group; and(ii) the resin composition includes: a polymer (P2) including the structural unit (A); and a polymer (P3) including the structural unit (B).