Fluorine Encapsulant Structure for UV-Resistant LED Packages
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Solution Overview
Problem
Current light emitting diode (LED) packages face challenges in enhancing light emission efficiency, particularly in managing light direction and durability when emitting in various wavelength bands, including ultraviolet, visible, and infrared ranges.
Innovation Solution
Incorporating a fluorine compound-based encapsulant that covers the LED chip, with specific geometrical configurations such as convex shapes and grooves on the substrate electrodes, to optimize light transmission and heat resistance, ensuring efficient light extraction and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional encapsulant is used to cover the LED chip, then the LED package structure is simple and easy to manufacture, but the light emission efficiency is insufficient and light transmission is limited
Solution Approach 1:
The patent changes the chemical composition parameters of the encapsulant by incorporating fluorine compounds (such as cyclic carbonate, cyclic carboxylate, or carbamate groups containing fluorine atoms). This compositional parameter change enables the encapsulant to achieve both high light transmission (80% or more across UV, visible, and infrared bands) and enhanced durability against ultraviolet-induced cracking, simultaneously improving light emission efficiency and long-term reliability.
Solution Approach 2:
The patent employs a composite encapsulant material system combining fluorine-containing cyclic carbonate, cyclic carboxylate, or carbamate compounds with specific functional groups. This composite material approach allows the encapsulant to exhibit dual functionality: high optical transparency across multiple wavelength bands for improved light extraction efficiency, and superior resistance to ultraviolet degradation for enhanced durability, resolving the contradiction between efficiency and reliability.
2Productivity
If the encapsulant covers the entire LED chip including separation space, then the light transmission path is maximized, but heat dissipation is impaired and reliability decreases
Solution Approach 1:
The patent applies local quality differentiation by selectively positioning the encapsulant to cover specific regions of the LED chip while leaving the separation space between substrate electrodes exposed. This localized coverage strategy optimizes light extraction from the active chip area while maintaining heat dissipation pathways through the uncovered separation space, and prevents encapsulant contact with electrodes that could cause electrical shorts, thereby simultaneously improving light extraction efficiency and structural reliability.
Solution Approach 2:
The patent segments the encapsulant coverage area into distinct zones: covered regions over the LED chip for light extraction enhancement, and uncovered regions at the separation space for heat dissipation and electrical isolation. This spatial segmentation allows different functional requirements to be satisfied in different locations, resolving the contradiction between maximizing light transmission and maintaining structural integrity.
3Reliability
If grooves are formed deep in substrate electrodes to prevent encapsulant contact, then electrical short prevention is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies partial action by forming grooves with controlled depth that extend only partially into the substrate electrodes, sufficient to prevent encapsulant contact and electrical shorts but not so deep as to create excessive manufacturing complexity. The groove depth is optimized to provide just enough electrical isolation while minimizing structural complexity and manufacturing difficulty, resolving the contradiction between reliability and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluorine compound encapsulant improves light emission efficiency by transmitting 80% or more of emitted light across various wavelength bands and maintains durability even under long-term ultraviolet exposure, preventing defects like cracking.
Implementation Method 1
The light-transmitting encapsulant refracts the light emitted from the light emitting diode, so that the direction in which the light travels can be controlled
Implementation Method 2
the encapsulant is provided so as to maintain durability even when exposed to ultraviolet rays for a long time
Data Source
AI summary
A light emitting diode package is provided to include: a package substrate including a first substrate electrode and a second substrate electrode spaced apart from each other; a light emitting diode chip disposed on the package substrate to be electrically connected to the first substrate electrode and the second substrate electrode; and an encapsulant containing a fluorine compound and covering the light emitting diode chip to be at least partially in contact with the light emitting diode chip.