3D Fluxgate Sensor Integration via Segmented Die Stacking
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Solution Overview
Problem
Existing fluxgate devices are costly and complex to implement, and they do not provide three-dimensional (3D) sensing in a single package platform, limiting their application in compact industrial settings.
Innovation Solution
The integration of multiple fluxgate dies on a package substrate with orthogonally arranged sensing axes, allowing for the addition of a third sensing axis within a single package platform, enabling space-efficient 3D electromagnetic sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple fluxgate dies are integrated on a package substrate with orthogonally arranged sensing axes, then 3D sensing capability is achieved in a single package platform, but device complexity increases
Solution Approach 1:
The device is divided into multiple discrete fluxgate dies, each responsible for sensing in a specific axis direction. Each die contains a magnetic core and coil structure optimized for its specific sensing direction, allowing independent fabrication and testing before integration into the final 3D sensing package.
Solution Approach 2:
The patent transitions from planar 2D sensing to three-dimensional 3D sensing by adding vertical stacking of fluxgate dies with orthogonally oriented sensing axes. The shortened vertical edge of certain dies enables this vertical dimension integration while maintaining orthogonality with the planar substrate surface.
2Adaptability or versatility
If multiple fluxgate dies are integrated on a package substrate, then 3D sensing is enabled, but manufacturing complexity increases
Solution Approach 1:
By segmenting the 3D sensing device into multiple independent fluxgate dies, each die can be manufactured using standard planar fabrication processes. This segmentation allows existing manufacturing infrastructure to produce each die separately, then they are integrated into the 3D configuration through mounting on the package substrate.
Solution Approach 2:
The package substrate serves multiple functions: it provides the mechanical platform for mounting fluxgate dies, establishes the orthogonal coordinate system for 3D sensing, and enables electrical interconnection between multiple dies. This multi-functionality reduces the need for additional specialized components.
3Adaptability or versatility
If fluxgate devices are interfaced with integrated circuits for industrial applications, then current measurement and position sensing are achieved, but cost increases
Solution Approach 1:
The patent combines multiple fluxgate sensing functions into a single integrated package, eliminating the need for separate devices for different sensing axes. This merging reduces the total component count, assembly requirements, and overall system cost while maintaining full 3D sensing capability for industrial applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for low-cost, high-yield fabrication of 3D sensing fluxgate devices that can be integrated with control circuits, providing efficient and compact 3D sensing capabilities without the need for additional substrates.
Implementation Method 1
a coil coiling around the first and second magnetic core segment to establish an aggregated magnetic core
Data Source
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AI summary
Described examples include an electromagnetic sensing device (100) with a package substrate (102), a first die (110) mounted on the package substrate (102), and a second die (150) mounted on the package substrate (102). The first die (110) includes a first integrated circuit (113) and a first magnetic core (116) formed above the first integrated circuit (113). The first magnetic core (116) has a first sensing axis (132) parallel to a planar surface (103) of the package substrate (102). The second die (150) includes a second integrated circuit (153) and a second magnetic core (156) formed above the second integrated circuit (153). The second magnetic core (156) has a second sensing axis (172) orthogonal to the planar surface (103) of the package substrate (102).