Flyover Cable Connector Layout for High-Density Surface Contacts

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Solution Overview

Problem

Existing electrical connectors face performance limitations in connecting multi-conductor cables to printed circuit boards, particularly at higher data rates, due to signal integrity issues and limited scalability for greater channel counts and contact density.

Innovation Solution

The design incorporates a flyover configuration of multi-conductor cables within the electrical connector, with parallel passageways and cable terminators that allow for improved spacing and reduced transitions between cables and surface contacts, enabling enhanced signal integrity and scalability through a 'flyover' configuration and compressive force application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional electrical connectors are used to connect multi-conductor cables to PCBs, then basic electrical connection is achieved, but signal integrity deteriorates at higher data rates due to proximity of cables to surface contacts

Engineering Contradiction:
Improvesignal integrityVSAvoidconnector structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces a vertical dimension by routing cables through passageways that extend from the top surface to the bottom surface of the connector body, allowing cables to pass 'over' or 'under' the contact array plane rather than approaching contacts laterally. This dimensional reconfiguration increases spacing between cables and surface contacts, reducing electromagnetic interference while maintaining a compact footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The connector body is segmented into distinct functional regions: cable entry zones, passageway sections, contact arrays, and exit regions. This segmentation allows independent optimization of each zone - cables can be routed through dedicated passageways with appropriate shielding and spacing, while contact arrays are positioned on surfaces optimized for electrical connection, thereby improving signal integrity without excessive overall complexity.

Inventive Principle:
Principle #1Segmentation

2Reliability

If cable spacing is increased to improve signal integrity, then electromagnetic interference is reduced, but connector size and complexity increase

Engineering Contradiction:
Improvesignal integrityVSAvoidconnector footprint
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

By transitioning from a planar layout to a three-dimensional passageway structure, the connector achieves increased effective spacing between cables and contacts without proportionally increasing the top-down footprint. The vertical passageways utilize the thickness dimension of the connector body to provide electromagnetic isolation, allowing compact surface area while maintaining signal integrity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The passageways are nested within the connector body structure itself, with cables routed through hollow channels formed in the connector housing. This nesting approach contains the cables within the connector's own volume rather than requiring external routing, thereby improving spacing and shielding without significantly increasing the overall external dimensions of the connector.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Productivity

If contact density is increased to support greater channel counts, then data rate capacity improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improvechannel countVSAvoidcontact alignment
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The contact array is segmented into modular units positioned on defined surfaces of the connector body. Each contact or contact pair can be independently positioned and manufactured with standard precision, while the overall high channel count is achieved through the modular repetition and systematic arrangement of these segments, thereby reducing the cumulative precision requirements compared to a monolithic high-density design.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12142861B2Connecting multi-conductor cables with surface contacts
Publication Date: 2024.11.12 CISCO TECHNOLOGY INC
  • US12142861B2 patent drawing
  • US12142861B2 patent drawing
  • US12142861B2 patent drawing

AI summary

A system includes a cage and a first coil. The cage includes a first end and a second end opposite the first end. The first end is arranged to receive an electrical connector. The second end is arranged to receive a pluggable module such that the electrical connector forms an electrical connection with the pluggable module. The first coil is positioned on or in the cage such that the first coil is arranged to deliver electric power to the pluggable module by inducing an electric current in a second coil positioned in or on the pluggable module when the pluggable module is connected to the electrical connector in the cage.