Foam Substrate Circuit Assembly with Dielectric Lining
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Solution Overview
Problem
The challenge is to efficiently manufacture circuit assemblies using foam substrates, as traditional metal plating processes are incompatible with foam materials, leading to ineffective copper deposition and damage to the substrate, making mass production of conducting vias through foamed substrates difficult.
Innovation Solution
A method involving the use of a solid dielectric lining within the foam substrate, which is machined and plated with a conducting material to form a via, allowing for standard metal plating processes to be applied, thereby enabling the creation of lightweight circuit assemblies suitable for mass manufacture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional electroplating technique is used on foam substrate, then copper coating can be deposited on standard circuit board material, but copper deposition is ineffective on foam surfaces and causes damage to the foam material
Solution Approach 1:
A solid dielectric lining is introduced as an intermediary material between the foam substrate and the copper plating process. The lining provides a suitable surface for copper deposition while protecting the foam material from direct exposure to the plating chemicals, thereby enabling effective copper coating without damaging the foam substrate
Solution Approach 2:
The via structure is segmented into three distinct parts: the foam substrate, the solid dielectric lining, and the copper coating. This segmentation allows each material to perform its optimal function - the foam provides lightweight structural support, the dielectric lining provides a plating-compatible surface, and the copper provides electrical conductivity
2Ease of manufacture
If traditional electroplating technique is used on foam substrate, then copper coating can be applied, but the foam substrate suffers damage and extended regions of damage penetrate into the substrate
Solution Approach 1:
The solid dielectric lining is applied beforehand to cushion and protect the foam substrate from the harmful effects of the electroplating process. This protective layer prevents chemical damage and mechanical damage during the plating operation, allowing the copper coating to be applied without compromising the foam substrate integrity
3Weight of moving object
If foam substrate is used to reduce weight, then weight savings of over 90% can be achieved, but standard metal plating processes become incompatible with the foam material
Solution Approach 1:
The solid dielectric lining serves as a mediator that bridges the incompatibility between foam substrates and metal plating processes. It allows the lightweight foam substrate to be used while providing a suitable surface for standard metal plating processes, thereby achieving both weight reduction and manufacturing compatibility
4Reliability
If conducting vias are formed manually using rivets or wire, then through-vias can be created in foam substrates, but the process is not suitable for mass manufacture
Solution Approach 1:
The manual mechanical process of forming vias with rivets or wire is replaced by an automated electroplating process. The solid dielectric lining enables standard electroplating equipment to be used, substituting manual operations with an automated chemical deposition process that is suitable for mass production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient and rapid production of circuit assemblies with conducting vias through foam substrates, achieving weight savings while maintaining the advantages of foam materials, and enabling the construction of multilayer assemblies with improved performance and reduced weight.
Implementation Method 1
the via is provided with a solid dielectric lining plated with a conducting material
Data Source
AI summary
A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).