Plasma Processing Focus Ring Dielectric Constant Control
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Solution Overview
Problem
Conventional plasma processing apparatuses face challenges in maintaining uniform voltage and top surface electric potential of the focus ring across different substrates, leading to non-uniform processing and decreased throughput due to the need for frequent replacement of dielectric members with varying dielectric constants.
Innovation Solution
A plasma processing apparatus with a dielectric ring and a dielectric constant varying device that adjusts the dielectric constant without exchanging the dielectric ring, using a conductor elevation device to control the top surface electric potential of the focus ring, ensuring uniform voltage application and maintaining high potential levels regardless of substrate type.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dielectric member is provided between the focus ring and the susceptor to change the top surface electric potential of the focus ring, then the process quality at the periphery of the substrate is improved, but the device complexity increases due to the need for frequent replacement of dielectric members with varying dielectric constants
Solution Approach 1:
The patent applies parameter changes by varying the dielectric constant of the dielectric ring through temperature control. The dielectric constant varying device changes the physical state or properties of the dielectric material, allowing adjustment of the electric field distribution without mechanical replacement. This resolves the contradiction by maintaining process quality uniformity while eliminating the complexity of frequent dielectric member replacement.
Solution Approach 2:
The patent implements dynamics by making the dielectric constant adjustable and changeable during operation. The dielectric constant varying device enables dynamic adaptation to different substrate types by changing the dielectric properties in real-time, rather than requiring static fixed dielectric members to be replaced manually. This dynamic adjustment capability improves both process quality and operational efficiency.
2Productivity
If the dielectric constant of the dielectric ring is adjusted to maintain uniform voltage application, then the processing rate is improved, but the device complexity increases due to the need for dielectric constant varying mechanisms
Solution Approach 1:
The patent uses parameter changes by controlling the physical state of the dielectric material through temperature variation. The dielectric constant varying device utilizes thermal effects to change the dielectric constant, which is a fundamental physical parameter. This approach improves processing rate by optimizing voltage distribution while adding only a temperature control mechanism rather than complex mechanical replacement systems.
Solution Approach 2:
The patent replaces mechanical replacement of dielectric members with a thermal field-based dielectric constant varying device. Instead of mechanically exchanging physical components, the system uses thermal energy to change the dielectric properties in situ. This substitution reduces mechanical complexity while achieving the same functional goal of voltage uniformity optimization.
3Reliability
If a dielectric member is provided between the focus ring and the susceptor, then the top surface electric potential of the focus ring is controlled, but the voltage uniformity deteriorates when substrate resistance varies with material or surface structure
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the dielectric constant based on substrate characteristics. When substrate resistance varies with material or surface structure, the dielectric constant varying device modifies the dielectric properties to compensate, maintaining both electric potential control and voltage uniformity across the substrate surface.
Solution Approach 2:
The patent implements feedback by using the dielectric constant varying device to respond to variations in substrate properties. The system adjusts the dielectric constant based on the actual electrical conditions created by different substrate materials or surface structures, creating a closed-loop control that maintains voltage uniformity while preserving electric potential control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for uniform voltage application to the substrate periphery, enhancing processing rates and reducing the need for dielectric ring replacements, thereby improving throughput and processing efficiency.
Implementation Method 1
a dielectric ring positioned between the focus ring and the susceptor; a dielectric constant varying device for varying a dielectric constant of the dielectric ring
Implementation Method 2
an electric field due to a potential difference is generated between the substrate (susceptor) and the inner side of the focus ring during a plasma process
Data Source
AI summary
There is provided a plasma processing apparatus including a susceptor, having a substrate mounting portion for mounting thereon a substrate; a focus ring including an outer ring and an inner ring; a dielectric ring; a dielectric constant varying device for varying a dielectric constant of the dielectric ring; a grounding body positioned at an outside of the dielectric ring with a gap from a bottom surface of the focus ring; and a controller for controlling a top surface electric potential of the focus ring by controlling a current flowing from the susceptor to the substrate.