Focus Ring Temperature Control via Segmented Heaters
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Solution Overview
Problem
Existing substrate treating apparatuses face challenges in precisely adjusting the temperature of the focus ring, which affects the uniform treatment of substrates during plasma etching processes, leading to inconsistent process reproducibility.
Innovation Solution
A substrate treating apparatus with a temperature control unit comprising a first heater, a second heater, and a cooling member, along with a heat transfer sheet, to precisely adjust the temperature of the focus ring, ensuring uniform treatment and improved process reproducibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple contact method is used to adjust the temperature of the focus ring, then the device complexity is reduced, but the temperature control precision deteriorates
Solution Approach 1:
The temperature control system is segmented into multiple independent heating zones (first heating unit and second heating unit) positioned at different locations of the focus ring. This allows independent temperature control of different regions, achieving precise temperature adjustment without requiring a single complex heating system.
Solution Approach 2:
Different heating units are applied to different local regions of the focus ring based on their specific temperature requirements. The first heating unit addresses temperature needs at one location while the second heating unit addresses another location, providing localized temperature control that improves overall precision.
2Device complexity
If a single heating unit is used for the focus ring, then the device complexity is reduced, but the temperature uniformity deteriorates
Solution Approach 1:
The heating system is divided into multiple segmented heating units distributed around the focus ring. Each heating unit independently controls the temperature of its local region, ensuring uniform temperature distribution across the entire focus ring while maintaining relatively simple device structure.
Solution Approach 2:
Multiple heating units are combined to work together on the same focus ring structure. The first heating unit and second heating unit operate simultaneously to maintain temperature uniformity, merging their effects to achieve comprehensive temperature control without requiring a single complex heating system.
3Device complexity
If the focus ring temperature is not precisely controlled, then the device complexity is reduced, but the process reproducibility deteriorates
Solution Approach 1:
The focus ring temperature control is segmented into multiple independent heating zones, allowing precise adjustment of temperature at different locations. This segmentation enables accurate temperature management that improves process reproducibility while keeping each heating unit relatively simple.
Solution Approach 2:
The temperature control system uses temperature sensors to monitor the actual temperature of the focus ring and feeds this information back to the control unit. The control unit adjusts the heating units based on this feedback to maintain the desired temperature, ensuring process reproducibility through closed-loop control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables precise temperature control of the focus ring, enhancing the uniformity of substrate treatment and improving the reproducibility of the plasma etching process by effectively managing temperature adjustments.
Implementation Method 1
a first heater which is disposed to heat the focus ring under the focus ring
Implementation Method 2
a second heater which is installed at a position opposite to the first heater under the first heater
Implementation Method 3
a cooling member which is provided under the second heater
Implementation Method 4
a heat transfer sheet interposed between the focus ring and the body and having a heat transfer rate higher than the heat transfer rate of the body
Implementation Method 5
a plasma source which generates plasma based on the process gas inside the treatment space
Implementation Method 6
an electromagnetic field is formed in an inner space of a chamber to form the plasma. The electromagnetic field excites process gas provided in the chamber to be in a plasma status
Data Source
AI summary
An apparatus for treating a substrate comprises a chamber having a treatment space for treating the substrate; a supporting unit which supports the substrate, inside the treatment space; a gas supplying unit which supplies process gas into the treatment space; and a plasma source which generates plasma based on the process gas inside the treatment space. The supporting unit comprises a supporting plate on which the substrate is placed; a focus ring which is disposed to surround the substrate supported by the supporting plate; a temperature control unit which adjusts a temperature of the focus ring. The temperature control unit may include a first heater which is disposed to heat the focus ring under the focus ring and to be opposite to the focus ring; and a cooling member which is provided under the first heater.