Focused Ion Beam Cross Section Processing for Uniform Etching

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Solution Overview

Problem

Samples composed of multiple substances with varying hardness pose a challenge for uniform cross section processing using focused ion beams, leading to non-flat observation surfaces and inaccurate analysis due to differences in etching rates.

Innovation Solution

A cross section processing method and apparatus that obtain cross section information through SEM, EDS, or EBSD measurements to vary the irradiation interval and time of the focused ion beam, ensuring a uniform etching rate across the sample by generating tailored irradiation conditions based on the etching rate map.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a focused ion beam is emitted toward an observation surface at a uniform irradiation density and irradiation time, then the processing is simple and quick, but the sample is not etched at a uniform etching rate due to varying hardness of different substances

Engineering Contradiction:
Improveprocessing speedVSAvoidetching uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by varying the irradiation amount of the focused ion beam according to the local material composition. The control unit adjusts irradiation parameters (irradiation interval, irradiation time, or irradiation amount) based on the etching rate map, which reflects the different hardness and etching characteristics of different substances in the sample. This ensures each region receives appropriate irradiation to achieve uniform etching across the entire observation surface.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent implements parameter changes by dynamically adjusting the irradiation parameters of the focused ion beam. The control unit modifies at least one of the irradiation interval, irradiation time, or irradiation amount based on the etching rate map obtained from cross-section information. This parameter adaptation allows the system to compensate for material hardness variations and achieve uniform etching rates across different substances in the sample.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the irradiation amount of the focused ion beam is varied based on cross section information, then a flat observation surface is formed with uniform etching rate, but the processing time increases due to additional measurement and control steps

Engineering Contradiction:
Improveobservation surface flatnessVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent applies preliminary action by obtaining cross-section information (through SEM, EDS, or EBSD measurements) and creating an etching rate map before performing the actual focused ion beam etching. This preliminary characterization allows the control unit to pre-determine the optimal irradiation parameters for each region, enabling the subsequent etching process to proceed efficiently with uniform results without requiring iterative adjustments during processing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements self-service by using the sample's own cross-section information (material composition and structure) to automatically determine the irradiation parameters. The control unit processes the obtained cross-section data to generate an etching rate map and automatically adjusts the focused ion beam irradiation accordingly, eliminating the need for manual parameter setting or external intervention. The sample essentially guides its own processing parameters.

Inventive Principle:
Principle #25Self-service

3Ease of manufacture

If a substance having high hardness acts as an etching mask, then the etching process is simpler, but curtaining occurs and concaves and convexes are formed on the observation surface

Engineering Contradiction:
Improveetching process simplicityVSAvoidsurface flatness
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent implements feedback by using the etching rate map (derived from cross-section information) to continuously guide and adjust the focused ion beam irradiation parameters. The control unit compares the local material properties with the desired uniform etching outcome and automatically modifies the irradiation amount, interval, or time for regions with high hardness. This closed-loop feedback mechanism prevents curtaining and surface irregularities by compensating for the etching mask effect of hard substances in real-time.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of a flat observation surface with a uniform etching rate, even in samples with different hardness levels, improving the accuracy of observation and analysis by preventing curtaining and surface irregularities.

Implementation Method 1

performing processing of a cross section of a sample by irradiating the sample with a focused ion beam

Methodology Applied
Scientific EffectFocused ion beam etching: Ion Beam

Implementation Method 2

obtaining cross section information of the sample

Methodology Applied
Scientific EffectElectron beam detection: Electron Beam

Implementation Method 3

energy dispersive X-ray spectrometry (EDS)

Methodology Applied
Scientific EffectEnergy dispersive X-ray spectrometry: X-Ray

Implementation Method 4

electron backscatter diffraction (EBSD)

Methodology Applied
Scientific EffectElectron backscatter diffraction: Diffraction

Data Source

PatentUS9548185B2Cross section processing method and cross section processing apparatus
Publication Date: 2017.01.17 HITACHI HIGH TECH ANALYSIS CORP
  • US9548185B2 patent drawing
  • US9548185B2 patent drawing
  • US9548185B2 patent drawing

AI summary

A cross section processing method and a cross section processing apparatus are provided in which it is possible to form a flat cross section in a sample composed of a plurality of substances having different hardness by a focused ion beam. The etching of a processing area is performed while variably controlling the irradiation interval, the irradiation time, or the like of a focused ion beam based on cross section information of an SEM image obtained by the observation of a cross section. In this way, even if a sample is composed of a plurality of substances having different hardness, it is possible to form a flat observation surface with a uniform etching rate.