Foldable Array Substrate Metal Trace Segmentation
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Solution Overview
Problem
The direct transfer of low temperature polysilicon (LTPS) backplane technologies to foldable products results in fragility and electrical leakage during bending, leading to low reliability of the metal traces in the array substrate.
Innovation Solution
The array substrate design includes multiple metal traces with alternating recesses and protrusions, which are electrically insulated from each other, and a method of manufacturing that forms these traces with varying thicknesses in insulating layers to increase wiring space and prevent breakage during bending and stretching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If LTPS backplane technologies are directly transferred to foldable products, then high resolution and fast reaction speed are achieved, but the backplane becomes fragile and traces break during bending
Solution Approach 1:
The metal traces are segmented into multiple layers with alternating patterns. Each layer contains recesses and protrusions that interlock with adjacent layers, dividing the continuous trace into discrete segments that can flex independently during bending, preventing breakage while maintaining electrical connectivity
Solution Approach 2:
The trace design transitions from a two-dimensional planar structure to a three-dimensional multi-layer structure. By adding the vertical dimension with alternating recesses and protrusions across multiple layers, the trace gains additional flexibility and stress distribution capabilities during bending operations
2Reliability
If metal traces are made continuous for electrical connectivity, then electrical conduction is maintained, but traces break during bending and stretching
Solution Approach 1:
The continuous trace is divided into multiple segments across different layers, where each segment maintains electrical connectivity through vertical connections. The segmentation allows each segment to flex independently, preventing stress concentration that would cause breakage in a continuous single-layer trace
Solution Approach 2:
Multiple trace layers are nested vertically with alternating recesses and protrusions. The protrusions of one layer fit into the recesses of adjacent layers, creating an interlocked nested structure that maintains electrical connectivity while providing mechanical flexibility during bending
3Strength
If metal traces are made thick for strength, then trace durability improves, but wiring space is insufficient and electrical leakage occurs
Solution Approach 1:
The trace structure utilizes the vertical dimension by creating alternating recesses and protrusions across multiple layers. This three-dimensional configuration increases the effective wiring space and electrical isolation volume without requiring larger planar dimensions, preventing electrical leakage while maintaining structural strength
Solution Approach 2:
The multi-layer trace structure with alternating recesses and protrusions creates a composite configuration that optimizes both mechanical strength and electrical isolation. The layered composite design provides enhanced durability through distributed stress while the recesses create adequate spacing to prevent electrical leakage
Data Source
AI summary
An array substrate, a method of manufacturing the same, and a display panel are provided to raise the wiring space of the metal trace in the longitudinal direction, to extend the length of the metal traces, to prevent the metal traces from being broken during the bending and stretching process, to improve the reliability of the metal traces during the bending and stretching process of the array substrate, and to improve the bending and tensile properties of the array substrate.