Foldable Display Dual-Layer Contacts for Impact Resistance

The single conductive layer is segmented into two separate conductive layers (first conductive layer and second conductive layer) that are disposed at different positions. The first conductive layer is positioned to overlap the contact hole, while the second conductive layer is positioned to overlap the semiconductor layer. This segmentation provides enhanced structural integrity and impact resistance at critical locations without requiring a completely complex new structure, as each layer has a specific functional position.

The solution transitions from a single-layer structure to a multi-layer structure in the vertical dimension. The first conductive layer and second conductive layer are arranged at different heights, creating a three-dimensional configuration that enhances mechanical strength and impact resistance. This dimensional change allows the structure to better absorb and distribute impact forces without significantly complicating the manufacturing process.

The patent applies local quality by providing enhanced structural reinforcement specifically at critical locations (contact holes and semiconductor layer areas) through the first and second conductive layers. The rest of the module maintains the lightweight, flexible structure necessary for foldable functionality. This localized strengthening allows the module to achieve foldable characteristics while maintaining durability at vulnerable points.

The first conductive layer is positioned to overlap the contact hole area, providing beforehand cushioning and protection to this vulnerable region. This pre-positioned structural support acts as a buffer against potential impact damage, allowing the module to maintain both foldable flexibility and enhanced durability at critical locations.