Foldable OLED Display Thermal Management via Active Semiconductor Cooling
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Solution Overview
Problem
Existing foldable OLED display modules face limitations in heat dissipation, leading to reduced service life and display quality due to poor thermal management.
Innovation Solution
A foldable display module design incorporating a heat conduction unit, semiconductor sinks, and a heat dissipation unit, where the semiconductor sinks absorb heat from the conduction unit and dissipate it through the heat dissipation unit using a direct-current voltage, with a sensing unit to activate heat dissipation only when the panel is unfolded.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a foldable display module is designed to be portable, then ease of carrying is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The heat dissipation system is segmented into multiple functional units: heat conduction unit, semiconductor sinks, and heat dissipation unit. Each unit performs a specific function in the heat transfer chain, allowing efficient heat management in a compact foldable structure.
Solution Approach 2:
Semiconductor sinks are introduced as intermediary elements between the heat conduction unit and heat dissipation unit. These sinks actively pump heat from the OLED panel through thermoelectric cooling, serving as a mediator that enhances heat transfer efficiency in the constrained space of a foldable device.
2Temperature
If active heat dissipation is implemented, then heat dissipation performance is improved, but power consumption increases
Solution Approach 1:
The sensing unit detects the folding state and activates the semiconductor sinks only when needed (when the display is unfolded and generating heat). This periodic activation based on operational state reduces unnecessary power consumption while maintaining heat dissipation performance when required.
Solution Approach 2:
A sensing unit provides feedback on the folding state of the display module. This feedback mechanism controls the activation of the semiconductor sinks, ensuring they operate only when the display is in the unfolded state and heat dissipation is actually needed, thereby optimizing power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces heat buildup, improving display performance and extending the service life of the OLED panel by active heat dissipation, while minimizing power consumption and ensuring stability in both folded and unfolded states.
Implementation Method 1
a plurality of semiconductor sinks located between the heat conduction unit and the heat dissipation unit... the plurality of semiconductor sinks are configured to absorb heat from the heat conduction unit and dissipate the heat through the heat dissipation unit, in response to a direct-current voltage applied to the plurality of semiconductor sinks
Implementation Method 2
the heat conduction unit is adhered to a side of the OLED display panel away from the light exit side and is configured to conduct heat from the OLED display panel
Data Source
AI summary
In one embodiment, a foldable display module includes a foldable OLED display panel; a heat conduction unit and a heat dissipation unit sequentially disposed on the OLED display panel in a direction away from a light exit side of the OLED display panel; and a plurality of semiconductor sinks located between the heat conduction unit and the heat dissipation unit, wherein the heat conduction unit is adhered to a side of the OLED display panel away from the light exit side and is configured to conduct heat from the OLED display panel; the semiconductor sinks are disposed on the heat conduction unit; the heat dissipation unit covers the semiconductor sinks and the heat conduction unit; and the semiconductor sinks are configured to absorb heat from the heat conduction unit and dissipate the heat through the heat dissipation unit, in response to a direct-current voltage applied to the semiconductor sinks.