Foldable Substrate for 3D IC Packaging Density
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Solution Overview
Problem
The challenge lies in developing an integrated circuit packaging system that achieves miniaturization, increased density, and reduced costs while maintaining performance, particularly for portable electronic devices, as existing technologies fail to fully address integration and cost reduction requirements.
Innovation Solution
The proposed solution involves a packaging system with a foldable substrate that includes a base segment, a stack segment, and connectors, where the stack segment is folded over the base segment, allowing for direct connection of stack substrate connectors to base substrate connectors, enabling efficient z-interconnection and simplified manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional packaging structures are used, then manufacturing processes are simplified, but packaging density and integration are limited
Solution Approach 1:
The patent implements package-on-package stacking where multiple integrated circuit packages are vertically nested within a single package substrate. The first integrated circuit package is mounted on the base segment, while the second integrated circuit package is mounted on the stack segment that folds over the base segment, achieving three-dimensional nesting that increases packaging density without proportionally increasing footprint area.
Solution Approach 2:
The invention transitions from two-dimensional planar packaging to three-dimensional vertical packaging by folding the stack segment over the base segment. This dimensional change allows multiple integrated circuit packages to be stacked vertically, significantly increasing packaging density while maintaining a compact form factor suitable for portable devices.
2Volume of moving object
If miniaturization is pursued, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The package substrate is divided into distinct functional segments: a base segment for mounting the first integrated circuit package, a stack segment for mounting the second integrated circuit package, and a foldable segment connecting them. This segmentation allows each segment to be independently designed and manufactured with optimized precision requirements, while the foldable segment provides mechanical tolerance compensation during assembly.
Solution Approach 2:
The foldable segment acts as a mechanical intermediary between the base segment and stack segment. It provides a flexible connection that absorbs manufacturing tolerances and alignment variations, reducing the stringency of precision requirements for connector placement while enabling compact miniaturized packaging.
3Area of stationary object
If integration is increased, then space is saved, but cost reduction becomes more challenging
Solution Approach 1:
The foldable segment introduces dynamic flexibility to the otherwise rigid package structure. This flexibility enables the stack segment to be positioned and aligned with the base segment during assembly, simplifying the manufacturing process and reducing costs while maintaining high integration density. The dynamic folding mechanism accommodates variations in component dimensions without requiring ultra-precise fixed positioning.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a foldable segment, a base segment, and a stack segment; connecting a base substrate connector directly on the base segment; connecting a stack substrate connector directly on the stack segment; mounting a base integrated circuit over the base segment with the base substrate connector outside a perimeter of the base integrated circuit; and folding the package substrate with the stack segment over the base segment and the stack substrate connector directly on the base substrate connector.