Folded Heat Conductive Sheet for Thermal Load Relief
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Solution Overview
Problem
In electronic control devices, thermal deformation and vibration of the circuit board apply loads to heat generating components, which can lead to damage and reliability issues due to high elastic modulus of traditional heat conductive members.
Innovation Solution
A heat conductive sheet with a folded structure and sliding layers is thermally coupled to both the heat generating component and the cooling mechanism, allowing it to deform and absorb these loads, reducing stress on the component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional heat conductive member with high elastic modulus is used, then heat conduction performance is improved, but the load acting on the heat generating component increases due to inability to deform under thermal deformation or vibration
Solution Approach 1:
The patent applies this principle by using a heat conductive sheet with a folded structure that can deform flexibly. The sheet includes multiple folded-back portions and connection portions that allow it to bend and absorb thermal deformation and vibration, reducing the load on the heat generating component while maintaining heat conduction performance
Solution Approach 2:
The patent applies this principle by changing the physical structure of the heat conductive member from a rigid form to a folded configuration. This structural parameter change enables the material to deform under thermal stress and vibration, transforming it from a rigid heat conductor to a flexible one that can accommodate dimensional changes without transmitting excessive load to the component
2Stability of the object's composition
If a rigid heat conductive member is used, then structural stability is improved, but the ability to accommodate thermal deformation and vibration is reduced
Solution Approach 1:
The patent applies this principle by designing a heat conductive sheet with a folded structure that transitions from a static rigid form to a dynamic flexible configuration. The folded-back portions and connection portions enable the sheet to adapt its shape in response to thermal deformation and vibration, providing both stability and adaptability
3Reliability
If a folded structure is introduced in the heat conductive sheet, then the load relief capability is improved, but the device complexity increases
Solution Approach 1:
The patent applies this principle by dividing the heat conductive sheet into multiple segments through folded-back portions and connection portions. This segmentation creates a series of connected sections that can independently deform, providing load relief capability while maintaining a relatively simple overall structure that is easier to manufacture than a completely rigid assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively relieves loads on heat generating components during thermal deformation or vibration, enhancing their reliability and heat radiation efficiency.
Implementation Method 1
a heat conductive sheet thermally coupled to one surface of the heat generating component located on a side opposite to the board side; and a cooling mechanism thermally coupled to the heat conductive sheet
Data Source
AI summary
An electronic control device includes: a board; a heat generating component mounted on the board; a heat conductive sheet thermally coupled to one surface of the heat generating component located on a side opposite to the board side; and a cooling mechanism thermally coupled to the heat conductive sheet. The heat conductive sheet includes a folded structure having a plurality of folded-back portions and a plurality of connection portions provided between the folded-back portions, and the plurality of folded-back portions of the heat conductive sheet is thermally coupled to each of the heat generating component and the cooling mechanism.