3D Folded Vapor Condenser for High-Heat Electronics
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Solution Overview
Problem
Traditional air cooling methods are inadequate for high heat load, high heat flux electronic devices, necessitating the development of aggressive thermal management techniques, particularly for densely packed circuits where power dissipation increases with operating frequency, and water-based cooling poses corrosion and electrical short circuit risks.
Innovation Solution
A vapor condenser with a three-dimensional folded structure that interleaves coolant-carrying channels with vapor condensing channels, utilizing a thermally conductive sheet with multiple folds to enhance heat transfer, allowing dielectric fluid vapor condensation and coolant circulation, thereby facilitating efficient cooling without the risks associated with water-based systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water-based cooling is used, then thermal conductivity and specific heat are improved, but corrosion and electrical short circuit risks increase
Solution Approach 1:
The patent uses a vapor barrier layer as an intermediary between the dielectric liquid coolant and the electronic components. This vapor barrier prevents direct contact between the coolant and electronics, eliminating corrosion and electrical short circuit risks while still allowing efficient heat transfer through the vapor condensation process.
2Reliability
If air cooling is used, then electrical safety is maintained, but heat removal capability is insufficient for high power density
Solution Approach 1:
The patent exploits the phase transition of dielectric liquid from liquid to vapor and back to liquid in the vapor condenser. This phase change process absorbs and releases large amounts of latent heat, dramatically increasing heat removal capability compared to air cooling, while maintaining electrical safety through the use of non-conductive dielectric fluid.
3Temperature
If condensation surface area is increased, then heat transfer efficiency is improved, but device volume increases
Solution Approach 1:
The patent transitions from a planar condensation surface to a three-dimensional folded structure with multiple layers and channels. This dimensional transformation packs a large condensation surface area into a compact volume by utilizing vertical and lateral folding, effectively increasing surface area without proportionally increasing the overall device footprint.
4Area of stationary object
If three-dimensional folded structure is used, then condensation surface area is increased, but manufacturing complexity increases
Solution Approach 1:
The patent divides the condensation surface into multiple discrete folded layers and channels within the vapor condenser structure. This segmentation allows each layer to be manufactured and assembled independently, simplifying the overall manufacturing process while achieving a large total condensation surface area through the stacked configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the condensation surface area and coolant-cooled surface area, providing efficient heat transfer in a compact volume while avoiding corrosion and electrical issues, enabling more efficient thermal management for high-density electronic components.
Implementation Method 1
a thermally conductive sheet with multiple folds therein
Implementation Method 2
vapor condensing channels... facilitate cooling of fluid vapor rising to the upper portion of the compartment
Data Source
AI summary
A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.