Folding Leadframe Structure for Magnetic Coupling Isolator Alignment
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Solution Overview
Problem
Existing magnetic coupling isolator technologies face challenges in achieving precise alignment and controlling magnetic coupling effects between coil portions, leading to inefficiencies in signal transmission and insulation voltage.
Innovation Solution
A foldable leadframe component and package structure are developed using a single leadframe structure, where the first leadframe is disposed above or under the second leadframe, allowing for precise alignment and magnetic coupling by rotating the first leadframe relative to the frame body, and an insulating package is formed to ensure electrical isolation and adjust the magnetic coupling strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single leadframe structure is used to form both coil portions, then manufacturing complexity is reduced, but alignment accuracy between the coil portions deteriorates
Solution Approach 1:
The leadframe structure is divided into a first leadframe and a second leadframe that can be independently formed and then assembled. This segmentation allows each leadframe to be manufactured separately with precise coil portions, and then joined together to achieve high alignment accuracy while maintaining manufacturing efficiency through modular production.
2Device complexity
If the first leadframe is fixed in position, then structural simplicity is maintained, but control over magnetic coupling effects deteriorates
Solution Approach 1:
The first leadframe is designed with a rotating capability relative to the frame body, transforming the static structure into a dynamic one. This allows the first leadframe to be rotated to precise angular positions to optimize the alignment between the first and second coil portions, thereby controlling magnetic coupling effects while maintaining relatively simple structural implementation through a single rotation degree of freedom.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves alignment accuracy and control over magnetic coupling, enabling efficient signal transmission and achieving high insulation voltage, suitable for semiconductor package elements like micro-transformers with enhanced magnetic coupling efficiency.
Implementation Method 1
enabling the first coil portion and the second coil portion to magnetically couple to each other
Data Source
AI summary
The present invention provides a leadframe component and a package structure. The leadframe component includes a first leadframe and a second leadframe. The first leadframe includes a first chip-mounting portion for carrying a first chip, a first coil portion, a plurality of first pins and a plurality of first floated pins. The second leadframe includes a second chip-mounting portion for carrying a second chip, a second coil portion, a plurality of second pins and a plurality of second floated pins. The first leadframe is disposed above or under the second leadframe for aligning the first coil portion with the second coil portion.