Tiled Force Sensor Array Sealing Without Losing Detection Area
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Solution Overview
Problem
The existing force sensors face challenges when tiled to form larger sensors, as the adjacent sealing portions reduce the force detection area and make them susceptible to liquid infiltration.
Innovation Solution
A force sensor design featuring an array layer with adjacent substrates, a conductive layer, a protection layer, and a counter electrode, where a bonding member seals the joints between substrates and a frame-shaped sealing portion surrounds the conductive layer to prevent liquid ingress while maintaining a detection region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple force sensors are tiled to form a large force sensor, then the detection area is expanded, but the sealing portions reduce the effective force detection area and create susceptibility to liquid infiltration
Solution Approach 1:
Multiple array substrates are tiled and bonded together to form a large array layer, merging multiple detection regions into one continuous force detection area. The bonding members join the substrates while the sealing portions are positioned to avoid overlapping detection regions, thus expanding the effective detection area while maintaining sealing integrity.
Solution Approach 2:
The sealing portions are repositioned from covering the joint regions between substrates to being located within non-detection regions at the periphery of the array layer. This spatial reconfiguration in the planar dimension allows the sealing function to be maintained without compromising the force detection area.
2Reliability
If sealing portions are placed at the joints of tiled substrates, then liquid infiltration is prevented, but the force detection area is reduced
Solution Approach 1:
The sealing function is extracted from the joint regions between substrates and relocated to the non-detection regions at the periphery of the array layer. This separation allows the sealing portions to perform their liquid barrier function without occupying the force detection area, thus resolving the contradiction between sealing integrity and detection area.
Solution Approach 2:
Bonding members are introduced as intermediaries to join the array substrates together at their joints. These bonding members provide the necessary mechanical bonding while the sealing portions are positioned separately in non-detection regions, allowing both bonding and sealing functions to be fulfilled without interfering with the force detection area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design expands the force detection area and prevents liquid entry, ensuring effective force sensing even when sensors are tiled, without compromising the sealing integrity.
Implementation Method 1
the conductive layer 4 uses, as a row material, a force sensitive conductive elastomer including a rubber material that has a high insulation property and serves as a mother material and conductive fine particles dispersed in the mother material
Data Source
AI summary
A force sensor including an array layer that includes array substrates arranged on an identical plane such that end portions thereof are adjacent to each other, the force sensor includesthe array layer having a first surface on which array electrodes are disposed and a second surface opposite to the first surface;a conductive layer layered on the first surface of the array layer;a protection layer layered on the conductive layer; anda counter electrode interposed between the conductive layer and the protection layer, whereina bonding member which bonds the adjacent array substrates and covers a joint between the adjacent array substrates is provided on the second surface of the array layer,the conductive layer is composed of a single member layered across each of the array substrates, anda sealing portion having a frame shape is provided on an outer circumference side of the conductive layer.