FOWLP Module Wire Bonding With Ground Metal-Paste RDL Pads
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Solution Overview
Problem
Existing FOWLP technologies face high manufacturing costs and environmental impact due to chemical plating, and there is a need to balance electrical extension and compact design while forming conductive circuits in the redistribution layer (RDL).
Innovation Solution
A module is developed with a substrate, dielectric layers, conductive circuits, and bonding wires, where conductive circuits are formed by grinding metal paste in slots, allowing for electrical connections between dies and electronic components through wire bonding, simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chemical plating or electroplating is used to form conductive circuits in the RDL, then electrical extension and interconnections are improved, but manufacturing cost increases and environmental friendliness deteriorates
Solution Approach 1:
The patent replaces chemical plating or electroplating processes with a mechanical grinding process to form conductive circuits. Metal paste is applied to the substrate and then ground to the desired thickness to create the RDL conductive circuits, eliminating the need for chemical baths and plating equipment while achieving the same electrical extension function.
Solution Approach 2:
The patent changes the formation method parameter from chemical/electrochemical deposition to mechanical removal. By controlling the grinding depth and metal paste composition, the conductive circuit thickness and conductivity are precisely controlled without requiring complex plating process parameters.
2Reliability
If chemical plating or electroplating is used to form conductive circuits in the RDL, then electrical extension and interconnections are improved, but environmental friendliness deteriorates
Solution Approach 1:
The patent replaces chemical plating or electroplating processes with a mechanical grinding process to form conductive circuits. Metal paste is applied to the substrate and then ground to the desired thickness to create the RDL conductive circuits, eliminating the need for chemical baths and plating equipment while achieving the same electrical extension function.
3Productivity
If the amount of dies is increased to increase performance, then computation ability is improved, but the complexity of forming electrical connections between dies and outside increases
Solution Approach 1:
The patent creates a universal substrate structure with standardized RDL and bonding pad arrangements that can accommodate multiple dies of different types and sizes. The same substrate and RDL formation process serves all dies, providing a multi-functional platform that simplifies interconnections regardless of the number or type of dies installed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing costs, enhances environmental friendliness, and enables efficient electrical connections, supporting high-performance and functionally diverse products with improved reliability and compact design.
Implementation Method 1
The respective second conductive circuits are formed by grinding of a metal paste filled in a plurality of second slots of the second dielectric layer
Data Source
AI summary
A module containing a fan-out wafer-level packaging unit connected to an electronic component by wire bonding and having a substrate, a first die, a first dielectric layer, first conductive circuits, a second dielectric layer, second conductive circuits, a second die, an electronic component, at least one first bonding wire, at least two second bonding wires, and at least one third bonding wire is provided. The second conductive circuits are formed by grinding of a metal paste filled in a plurality of second slots of the second dielectric layer. The second conductive circuits form bonding pads in the second slots. The first die is electrically connected to the outside by the bonding pads around a chip area of a second surface of the first die. Thereby the problems generated during manufacturing of the conductive circuits including higher manufacturing cost and less environmental benefit are solved.