Front-Side Antenna Assembly for RF Wafer Packaging
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Solution Overview
Problem
The packaging of radio frequency integrated circuit die leads to signal insertion loss and electromagnetic interference due to increased complexity and size reduction in electronic systems, which also increases packaging costs.
Innovation Solution
An integrated antenna assembly is implemented in wafer level packaging, where a printed circuit board is attached to the front side of a package substrate with an embedded die, and an antenna enabling element is placed within a cavity on the front side, reducing the signal path distance between the antenna and the die from 300-650 microns to 20-100 microns, eliminating the need for backside contact technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If backside contact technology is used to attach antenna to RF packaged device, then antenna can be connected to die, but signal path distance becomes long (300-650 microns) causing signal loss and noise
Solution Approach 1:
Instead of attaching the antenna to the backside of the packaged device (conventional approach), this patent inverts the approach by attaching the antenna to the front side of the package substrate. This inversion allows the antenna to be positioned much closer to the die (20-100 microns vs. 300-650 microns), significantly reducing signal path distance and improving signal quality for millimeter-wave frequencies.
2Volume of moving object
If system size is reduced, then electronic systems become more compact, but system complexity increases leading to higher packaging costs
Solution Approach 1:
This patent merges the antenna assembly with the package substrate by attaching the antenna directly to the front side of the same substrate that holds the die. This integration eliminates the need for separate backside contact structures and vias, reducing system complexity while maintaining compact size. The merged design simplifies the overall packaging structure and reduces manufacturing costs.
3Length of moving object
If antenna is placed on front side of package substrate, then signal path distance is reduced to 20-100 microns, but requires cavity in PCB which increases PCB complexity
Solution Approach 1:
The patent implements a nested structure where a cavity is formed within the PCB, and the antenna enabling element is placed inside this cavity. The cavity is created by removing material from the PCB, creating a recessed space that houses the antenna assembly. This nesting approach allows the antenna to be positioned close to the die while integrating the antenna structure within the existing PCB footprint, minimizing overall space requirements.
Data Source
AI summary
Embodiments are provided for a packaged semiconductor device that includes a package substrate that in turn includes an embedded die configured to process a radio frequency (RF) signal; a printed circuit board (PCB) attached to a front side of the package substrate, where the PCB includes a cavity; and an antenna enabling element attached to the front side of the package substrate within the cavity, the antenna enabling element configured to convey the RF signal through the cavity.