Functionalized CMP Pad Regeneration for Abrasive-Free Planarization
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Solution Overview
Problem
Conventional chemical mechanical planarization (CMP) processes are inefficient, prone to defects, and require redundant overplanarization, leading to increased costs and lower productivity due to the use of abrasive slurries and mechanical abrasion, which can contaminate substrates and cause defects.
Innovation Solution
A method using an abrasive-free planarization solution with a functionalized chemical pad that chemically reacts with substrate material, followed by a regeneration process to break bonds and recover valuable metals, and a closed-loop system for recycling the pad and recovered materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If abrasive-free or reactive aqueous solutions are used to achieve planarization using reactive or functionalized pad structures, then defects are reduced, but it becomes challenging to maintain continuous high-level performance as the reactivity of each pad degrades
Solution Approach 1:
The patent applies the discarding and recovering principle by implementing a regeneration process that recovers the reactivity of functionalized pads. The system collects effluent containing removed material, processes it to restore pad reactivity, and returns it to the planarization process. This allows continuous high-level performance to be maintained without discarding the pads after single use, thereby resolving the contradiction between defect reduction and continuous productivity.
Solution Approach 2:
The patent implements a feedback mechanism where the effluent from the planarization process is collected, analyzed, and processed to regenerate the functionalized pads. The regenerated effluent is then fed back into the planarization process. This closed-loop feedback system ensures that pad reactivity is continuously restored, maintaining high-level performance while reducing defects associated with conventional abrasive methods.
2Productivity
If conventional CMP processes use abrasive slurries and mechanical abrasion, then planarization is achieved, but substrates are contaminated and defects are caused
Solution Approach 1:
The patent replaces the mechanical abrasion system with a chemical reaction system. Instead of using abrasive particles and mechanical force to remove material, the invention uses functionalized pads that chemically react with substrate material to achieve planarization. This substitution eliminates the harmful mechanical abrasion that causes substrate contamination and defects, while maintaining planarization capability through chemical etching reactions.
Solution Approach 2:
The patent introduces an intermediary chemical reaction mechanism between the pad and substrate. The functionalized pad acts as an intermediary that facilitates controlled material removal through chemical bonding and reaction, rather than direct mechanical contact and abrasion. This intermediary chemical process selectively removes material without the contaminating effects of conventional abrasive slurries, thereby reducing defects while maintaining productivity.
3Manufacturing precision
If conventional CMP processes are used, then planarization is achieved, but redundant overplanarization is required leading to increased costs and lower productivity
Solution Approach 1:
The patent changes the fundamental parameter of material removal from mechanical abrasion to chemical reaction. This parameter change enables more precise and controlled material removal rates, eliminating the need for redundant overplanarization passes. The chemical reaction process can be tuned through effluent regeneration to achieve optimal removal rates that produce the desired surface planarization in a single pass, thereby improving productivity and reducing costs.
Solution Approach 2:
The patent implements continuous regeneration of the functionalized pads through effluent processing and recycling. This continuous action maintains optimal pad reactivity throughout the planarization process, ensuring consistent material removal rates and surface quality. The continuous regeneration eliminates the need for intermittent pad replacement and redundant planarization passes, thereby improving productivity and cost efficiency while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves smoother substrate surfaces without defects, extends pad lifetime, and recovers valuable materials, reducing waste and maintenance costs while maintaining high productivity.
Implementation Method 1
The functional groups are configured to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups
Implementation Method 2
applying a regeneration solution configured to break bonds between the functional groups and substrate material bonded to the functional groups
Implementation Method 3
The removed material is complexed in a dissolved complexing agent to form dissolved material in an effluent phase
Implementation Method 4
The dissolved material is extracted into a liquid extraction phase
Data Source
AI summary
A method comprises planarizing a substrate material with a functionalized chemical planarization pad. The functionalized chemical planarization pad includes a plurality of functional groups bonded to a material of the pad. The functional groups are configured to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups. The pad is regenerated by applying a regeneration solution configured to break bonds between the functional groups and substrate material bonded to the functional groups to form removed material. The removed material is complexed in a dissolved complexing agent to form dissolved material in an effluent phase.