Dual-Polarization GaN Transistors for Static Current and Noise Immunity

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Solution Overview

Problem

Integrated circuits (ICs) face challenges in minimizing static current while maintaining noise immunity due to the limitations of multi-stage enhancement-mode high-electron-mobility transistors (HEMT) based drivers, which lack sufficient over-drive voltage and are prone to noise immunity issues when threshold voltage (Vt) is reduced across multiple stages.

Innovation Solution

The implementation of dual-Vt transistors with different active layer thicknesses, specifically aluminum gallium nitride (AlGaN) layers on a gallium nitride (GaN) channel layer, allows for varying threshold voltages by adjusting polarization, enabling reduced static current and increased over-drive voltage without compromising noise immunity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If multi-stage E-HEMT based drivers are used to minimize static current, then static current is reduced, but over-drive voltage becomes insufficient due to cumulative Vt drops across stages

Engineering Contradiction:
Improvestatic currentVSAvoidover-drive voltage
Core Design Contradiction:
Loss of energyVSPower

Solution Approach 1:

The patent applies parameter changes by varying the threshold voltage (Vt) across different transistor stages. Specifically, earlier stages use transistors with higher Vt to minimize static current, while the last stage uses transistors with lower Vt to provide sufficient over-drive voltage. This gradient approach resolves the contradiction by optimizing each stage's Vt parameter according to its functional requirements.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements dynamics by making the threshold voltage characteristic variable across the driver stages rather than uniform. The Vt is dynamically adjusted from higher values in initial stages to lower values in the final stage, allowing the driver to adapt its electrical characteristics to meet both static current minimization and over-drive voltage requirements at different points in the signal path.

Inventive Principle:
Principle #15Dynamics

2Power

If Vt is reduced in pull-up E-HEMT transistors to provide enough over-drive voltage, then over-drive voltage increases, but noise immunity is compromised

Engineering Contradiction:
Improveover-drive voltageVSAvoidnoise immunity
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent applies local quality by assigning different Vt characteristics to different locations (stages) within the driver circuit. The last stage, which requires high over-drive voltage, uses transistors with lower Vt, while earlier stages use transistors with higher Vt for better noise immunity. This spatial differentiation of electrical properties resolves the contradiction by providing low Vt only where high over-drive voltage is needed.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the Vt parameter selectively across stages, with the last stage employing lower Vt transistors to achieve sufficient over-drive voltage while maintaining noise immunity through the protected input stage. This targeted parameter modification allows the system to achieve high over-drive voltage without compromising overall noise immunity.

Inventive Principle:
Principle #35Parameter changes

3Power

If Vt is reduced across all transistors on the wafer to improve driver performance, then over-drive voltage increases, but all transistors including power switch HEMT suffer from poor noise immunity

Engineering Contradiction:
Improveover-drive voltageVSAvoidnoise immunity
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent implements local quality by creating transistors with different Vt characteristics at different locations on the wafer. The power switch HEMT and input stages maintain higher Vt for noise immunity, while only the last stage driver transistors have lower Vt for sufficient over-drive voltage. This localized differentiation resolves the contradiction by applying low Vt only where necessary.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies segmentation by dividing the transistor population into distinct groups with different Vt characteristics. Rather than uniformly reducing Vt across all transistors, the invention segments them into high-Vt devices for noise-critical applications and low-Vt devices for over-drive voltage requirements, thereby resolving the contradiction through functional categorization.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces static current and provides sufficient over-drive voltage for IC drivers, enhancing noise immunity by allowing for flexible Vt configurations tailored to specific functions, thereby improving performance and reducing static current.

Implementation Method 1

dual-Vt transistors with different active layer thicknesses, specifically aluminum gallium nitride (AlGaN) layers on a gallium nitride (GaN) channel layer, allows for varying threshold voltages by adjusting polarization

Methodology Applied
Scientific EffectPolarization: Polarisation

Data Source

PatentUS11990541B2Apparatus and circuits with dual polarization transistors and methods of fabricating the same
Publication Date: 2024.05.21 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US11990541B2 patent drawing
  • US11990541B2 patent drawing
  • US11990541B2 patent drawing

AI summary

Apparatus and circuits with dual polarization transistors and methods of fabricating the same are disclosed. In one example, a semiconductor structure is disclosed. The semiconductor structure includes: a substrate; an active layer that is formed over the substrate and comprises a first active portion having a first thickness and a second active portion having a second thickness; a first transistor comprising a first source region, a first drain region, and a first gate structure formed over the first active portion and between the first source region and the first drain region; and a second transistor comprising a second source region, a second drain region, and a second gate structure formed over the second active portion and between the second source region and the second drain region, wherein the first thickness is different from the second thickness.