Gas Cluster Ion Beam Shaping for Substrate Uniformity
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Solution Overview
Problem
There is a need for a method and system that can perform location-specific processing on substrates using a gas cluster ion beam (GCIB) to correct non-uniformities and adjust properties, such as geometrical, mechanical, and optical parameters, to enhance the yield and repeatability of substrate processing, particularly in the semiconductor industry.
Innovation Solution
A system and method involving a GCIB processing system that includes a metrology system for acquiring data, a multi-process controller to compute correction data, and a GCIB source to apply the adjusted beam properties to the substrate, using shaping apertures to customize the beam resolution for specific spatial gradients, allowing for precise correction of substrate surface asperities and non-uniformities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional ion beam is used for substrate processing, then deep subsurface damage occurs, but the desired surface modification is achieved
Solution Approach 1:
The patent changes the fundamental parameter of the ion beam by using gas cluster ions instead of conventional atomic ions. The cluster ions have a different mass distribution and energy deposition profile, allowing surface modification without deep subsurface damage. The cluster ions disintegrate on impact, distributing energy across multiple collision events rather than a single deep penetration event.
Solution Approach 2:
The patent utilizes the phase transition behavior of gas clusters upon impact with the substrate. The gas cluster ions undergo a phase transition from a bound cluster state to dispersed atomic/molecular states during the bombardment process, releasing energy in a controlled manner that modifies the surface without causing deep damage.
2Adaptability or versatility
If a uniform beam is used for substrate processing, then the entire substrate is treated, but location-specific processing cannot be achieved
Solution Approach 1:
The patent implements local quality by allowing different regions of the substrate to receive customized beam parameters. The beam properties (such as intensity, duration, or cluster size) can be varied spatially across the substrate surface, enabling location-specific processing of defects or features while maintaining overall processing efficiency through automated control.
Solution Approach 2:
The patent introduces dynamic control of beam parameters during the processing operation. The beam properties can be adjusted in real-time based on the specific location being processed, allowing the system to adapt to different regions of the substrate while maintaining high productivity through automated parameter adjustment.
3Manufacturing precision
If the beam resolution is increased for precise processing, then location-specific accuracy improves, but the processing area covered decreases
Solution Approach 1:
The patent applies segmentation by dividing the substrate processing into multiple zones or regions, each handled by beam parameters optimized for that specific area. The GCIB system can scan or step through different regions with high-resolution precision while maintaining the ability to cover the entire substrate area through systematic traversal and parameter adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise and repeatable location-specific processing, improving substrate uniformity and yield by adjusting beam properties based on spatial gradients, thereby enhancing the processing accuracy and efficiency.
Implementation Method 1
The gas clusters can be ionized by electron bombardment, which permits the gas clusters to be formed into directed beams of controllable energy.
Implementation Method 2
Clusters of atoms can be formed by the condensation of individual gas atoms (or molecules) during the adiabatic expansion of high pressure gas from a nozzle into a vacuum.
Implementation Method 3
The ion clusters disintegrate on impact with the workpiece. Each individual molecule in a particular disintegrated ion cluster carries only a small fraction of the total cluster energy.
Data Source
AI summary
A method and system of location specific processing on a substrate is described. The method comprises establishing a gas cluster ion beam (GCIB) according to a set of beam properties and measuring metrology data for a substrate. Thereafter, the method comprises determining at least one spatial gradient of the metrology data at one or more locations on the substrate and adjusting at least one beam property in the set of beam properties for the GCIB according to the determined at least one spatial gradient. Using the metrology data and the adjusted set of beam properties, correction data for the substrate is computed. Following the computing, the adjusted GCIB is applied to the substrate according to the correction data.