Cells TRIZ Cases

Electron beam deposition forms wire grid structures on carrier substrates using controlled metal ion reduction.

Acetylene pretreatment suppresses methane generation by blocking methanogen activity, increasing hydrogen yield and cell lifespan.

Spray-formed zinc anode panel embeds glass fibers in a conductive cement matrix.

Rotating the target, substrate, and shield plate controls incident angles to form uniform uniaxial magnetic anisotropy films in a compact apparatus.

A molybdenum complex catalyst enables room temperature ammonia synthesis through direct electrochemical nitrogen reduction.

Transition metal doped Sm2Ru2xM2-2xO7 pyrochlores enhance acidic oxygen evolution activity and durability while reducing precious metal costs.

Porous scrubber filters ionic byproducts from liquid plating solution, preventing contamination and extending electrolyte life.

Water vapor feedstock with cation conduits eliminates gas bubble interference, enabling sustained electrolysis current densities at lower voltages.

A single supply system distributes sulfuric acid to both chambers, maintaining oxidizing agent concentration without complex dual piping.

A membrane-electrode assembly uses mixed iridium and ruthenium catalysts to lower precious metal loading in polymer electrolyte water electrolysis stacks.

Bromination converts hydrogen sulfide into hydrogen bromide for electrolytic hydrogen production, eliminating costly gas sweetening facilities.

A zero-gap electrolytic generator uses a polymer membrane to separate electrodes while enabling alternating polarity operation.

Segmenting the anode holder from the anode structure via a detachable feeding member resolves the weight-volume contradiction during plating tank maintenance.

A fuel production system calculates input and recovered energy to determine water-electrolyzed hydrogen supply amounts for synthesis gas generation.

Independent control electrode potentials compensate for impedance differences to maintain film thickness uniformity during long-term target use.

A non-revolving plating rack with a sparger and diffuser establishes laminar flow across magnetic disk substrates.

Flattened Sb-Te alloy particles improve transverse rupture strength and reduce oxygen content, preventing target fractures and abnormal electrical discharge.

An ion-exchange membrane electrolyzer separates gas compartments while an air pump dilutes hydrogen concentration, preventing explosion risks in small volumes.

A low angle membrane frame maintains uniform plating thickness by managing trapped air and anode chamber resistance.

Alternating supply holes distribute electrolyte across electrodes, reducing pressure loss and increasing flow uniformity.

Dual-loop voltage control stabilizes reactive sputtering plasma emission spectra during compound film deposition.

A platinized nanostructured layer catalyzes hydrogen and oxygen recombination within the membrane, mitigating crossover hazards at high operating pressures.

Copper sulfide nanoparticles on gallium nitride nanowires drive formic acid production with high Faradaic efficiency despite hydrogen sulfide impurities.

Segmented contact fingers overcome adhesion during removal, preventing breakage from excessive robot torque.

Replacing energy-intensive thermal processes, this system uses oxygen as a regenerating oxidant to lower operational costs for remote natural gas utilization.

An evaporation unit removes water from the catholyte stream, preventing product dilution and lowering separation energy costs.

Water electrolysis apparatus generates hydrogen while concentrating hydroxide ions to capture carbon dioxide from gas streams.

Spring-like elastic members adjust electrode spacing to reduce electrolytic voltage while preventing membrane damage from excessive pressure.

Dynamic segmentation of the reference electrode maintains uniform current density across the substrate, preventing seed layer degradation.

Asymmetric composite electrodes with controlled zeta potential remove multivalent cations from hard water without faradaic reactions.

Concentric electrode pairs maintain constant anodic and cathodic areas during polarity reversal, minimizing edge effects and optimizing current transmission.

Methane sulfonic acid rinse removes residual electroplating solution from wafers, preventing copper bath cross-contamination and maintaining throughput.

A plating apparatus uses an electric potential sensor and state space model to estimate current density for real-time film thickness calculation.

Increasing catalyst content from upstream to downstream in a fuel electrode balances electrolysis efficiency and reduces carbon deposition.

Segmented air tubes eliminate dead zones in anodizing tanks, ensuring uniform chemical distribution and consistent cosmetic finishes.

A submerged electric arc system delivers liquid feedstock through electrodes to generate combustible gas efficiently.

Low acid electroplating enhances ion mobility to fill deep through silicon vias rapidly without void formation.

Integrated sealing and insulation on the electrolyser frame resolve gas leakage and assembly complexity.

A gas cluster ion beam system adjusts beam properties to correct substrate surface asperities.

A control method manages water levels and depressurizes the cathode side of a differential pressure electrolysis system after operation stops.

Segmented anode rods with slip joints resolve corrosion and thermal expansion trade-offs, enabling flexible production of reduced metallic products.

A bipolar electrochemical process exfoliates graphite and deposits reduced graphene oxide layers on conductive substrates.

An electrolytic processing unit uses direct and indirect electrodes to drive ion movement across a semiconductor substrate surface.

An SOFC module balances seal pressures via an equalization gas circuit, eliminating the need for complex pressurized enclosures.

A substrate transfer sputtering apparatus uses a reciprocating magnet to deposit thin films with controlled electrical properties.

Segmented electrodeposition cells resolve the contradiction between high production rate and process complexity by enabling independent layer control.