Gas Cooled Electrostatic Chuck for MEMS Thermal Stability

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Solution Overview

Problem

Conventional de-ionized water cooling systems for electrostatic chucks in semiconductor manufacturing fail to maintain stable temperatures during high-power, high-temperature processes, leading to temperature variations and potential thermal shock, which affects the quality of microelectromechanical systems (MEMS) devices.

Innovation Solution

A gas cooling system for electrostatic chucks, utilizing a cooling plate with gas channels and a gas box to control the flow of cooling gases like nitrogen or clean dry air, which maintains temperature stability within ±7.5 degrees Celsius, reducing thermal shock and enhancing the throughput of MEMS device manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If de-ionized water cooling system is used for electrostatic chuck, then cooling efficiency is improved, but temperature stability deteriorates and thermal shock damage occurs at temperatures of 400 degrees Celsius and greater

Engineering Contradiction:

Improvetemperature stabilityVSAvoidthermal shock damage

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent changes the cooling parameter from liquid (de-ionized water) to gas (inert gas), which fundamentally alters the thermal interaction characteristics. Gas cooling provides more gradual and uniform heat removal, preventing thermal shock while maintaining temperature stability during high-temperature semiconductor processing

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces an inert gas cooling environment that not only provides cooling functionality but also creates a chemically inert atmosphere suitable for high-temperature processing. This eliminates the thermal shock problem associated with liquid water while maintaining reliable operation at 400°C and above

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Temperature

If de-ionized water cooling system is used for electrostatic chuck, then initial cooling performance is adequate, but temperature control capability deteriorates during extended fabrication runs processing multiple substrates

Engineering Contradiction:

Improvetemperature control stabilityVSAvoidfabrication run duration

Core Design Contradiction:

TemperatureVSDuration of action of moving object

Solution Approach 1:

The gas cooling system enables continuous stable cooling throughout extended fabrication runs. The inert gas continuously circulates through the cooling channels, maintaining consistent temperature control across multiple substrate processing cycles without the temperature drift observed in liquid cooling systems

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

Changing from liquid to gas cooling medium fundamentally improves long-term temperature stability. The gas system maintains consistent thermal properties throughout extended operation, preventing the temperature trending upward that occurs with liquid cooling during multi-substrate fabrication runs

Inventive Principle:

Principle #35Parameter changes

3Productivity

If rapid temperature variation occurs in electrostatic chuck, then processing speed may be increased, but manufacturing precision deteriorates due to stress in deposited films

Engineering Contradiction:

Improveprocessing speedVSAvoidfilm deposition quality

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The gas cooling system provides beforehand cushioning by maintaining stable temperature conditions that prevent excessive thermal stress in deposited films. This allows high-speed processing while protecting film quality through proactive temperature stabilization

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The gas cooling system effectively limits temperature variations, ensuring consistent processing conditions for MEMS devices, even at high temperatures, thereby reducing manufacturing defects and extending equipment lifespan by preventing thermal damage.

Implementation Method 1

flowing the cooling gas from the gas box through a cooling plate coupled to an electrostatic chuck

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

flow of cooling gases like nitrogen or clean dry air, which maintains temperature stability

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

running the cooling gas through a heat exchanger in the gas box to cool the cooling gas

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS10781518B2Gas cooled electrostatic chuck (ESC) having a gas channel formed therein and coupled to a gas box on both ends of the gas channel

Publication Date: 2020.09.22 APPLIED MATERIALS INC

AI summary

Embodiments of the disclosure include an electrostatic chuck assembly, a processing chamber and a method of maintaining a temperature of a substrate is provided. In one embodiment, an electrostatic chuck assembly is provided that includes an electrostatic chuck, a cooling plate and a gas box. The cooling plate includes a gas channel formed therein. The gas box is operable to control a flow of cooling gas through the gas channel.