Gas Distribution Plate Temperature Control via Coordinated Heating and Cooling
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Solution Overview
Problem
The existing temperature control methods for gas distribution plates in substrate treating apparatuses face challenges in precision and resistance to disturbances, particularly due to the interference between heating and cooling controllers, and external influences like RF power, which complicates maintaining optimal temperature for etching processes in semiconductor manufacturing.
Innovation Solution
A substrate treating apparatus with a temperature control unit that includes a heating member, a cooling member, and a control member. The control member uses correlation and disturbance coefficients to filter feedback inputs, allowing simultaneous control of the heating and cooling members, thereby accurately managing the temperature of the gas distribution plate by considering interactions between the heating and cooling members and external influences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If independent PID controllers are used for heating and cooling members, then temperature control is achieved, but controller interference occurs and design becomes difficult
Solution Approach 1:
The patent merges the heating and cooling control into a unified control system that processes both signals through a single controller. The controller integrates feedback from both heating and cooling members, applying coordinated control algorithms to eliminate interference between the two independent control loops while maintaining reliable temperature control of the gas distribution plate.
2Measurement precision
If traditional temperature control methods are used, then basic temperature regulation is achieved, but precision is insufficient due to external disturbances like RF power
Solution Approach 1:
The patent implements a feedback mechanism where the controller continuously monitors temperature and adjusts both heating and cooling member signals based on the temperature deviation. This closed-loop feedback system compensates for external disturbances such as RF power variations by dynamically adjusting control signals to maintain precise temperature control of the gas distribution plate.
3Speed
If heating and cooling members are controlled simultaneously without coordination, then response speed is fast, but temperature stability deteriorates due to mutual interference
Solution Approach 1:
The controller acts as an intermediary that coordinates the heating and cooling members. It processes temperature feedback and generates coordinated control signals that prevent mutual interference while maintaining fast response. The controller mediates between the heating and cooling actions, ensuring they work synergistically rather than conflicting, thus achieving both rapid temperature response and stable temperature maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the precision and stability of temperature control for the gas distribution plate, minimizing disturbances and ensuring optimal conditions for etching processes by effectively managing the interaction between heating and cooling members and external factors.
Implementation Method 1
a heating member that heats the gas distribution plate
Implementation Method 2
a cooling member that cools the gas distribution plate
Data Source
AI summary
Disclosed is a substrate treating apparatus including a chamber having a process space therein in which a substrate is treated, a substrate support assembly located in the chamber and including a support plate that supports the substrate, a gas supply unit that supplies gas into the chamber, a gas distribution plate that distributes the gas and supplies the gas into the process space, and a temperature control unit that controls temperature of the gas distribution plate. The temperature control unit includes a heating member that heats the gas distribution plate, a cooling member that cools the gas distribution plate, and a control member that controls the heating member and the cooling member, based on a correlation coefficient regarding an interaction of the heating member and the cooling member and a disturbance coefficient regarding an external influence.